A Guide to Broadband Processors, Third Edition
     
List of Tables
       
 

Return to
Report Page

 
Table #  
Page
Table 1-1. OSI and TCP/IP layers
2
Table 1-2. Bandwidth of common interfaces
3
Table 1-3. ITU-T standards for ATM adaptation layers
6
Table 1-4. IETF RFCs for IP encapsulation over ATM
6
Table 1-5. Voice coding standards for VoIP
11
Table 2-1. Common DSL variants
27
Table 2-2. ADSL annexes
30
Table 2-3. ADSL and VDSL2 profiles
32
Table 2-4. PON standards and characteristics
36
Table 2-5. GPON traffic containers
39
Table 2-6. Comparison of PON standards
41
Table 3-1. Hierarchy of access equipment
47
Table 4-1. Bandwidth requirements for typical broadband services
53
Table 6-1. Key parameters for BroadLight GPON components
94
Table 7-1. Key parameters for Centillium CPE products
103
Table 8-1. Key parameters for Conexant DSL products
113
Table 9-1. Key parameters for Ikanos Fx chip set
123
Table 9-2. Key parameters for Ikanos CPE broadband components
125
Table 10-1. Key parameters for Infineon VDSL-CO products
134
Table 10-2. Key parameters for Infineon VDSL2 products for CPE
136
Table 11-1. Key parameters for PMC-Sierra gateway processors
145
Table 11-2. Key parameters for PMC-Sierra PON products
146
Table 12-1. Key parameters for Teknovus EPON products
160
Table 13-1. Key parameters for Freescale MSC7120 GPON processor
181
Table 13-2. Key parameters for Iamba GPON products
186
Table 14-1. Summary of high-speed broadband chip vendors and products
192
Table 14-2. Comparison of VDSL2 components for DSLAMs
193
Table 14-3. Comparison of VDSL2 components for CPE
196
Table 14-4. Comparison of EPON components for OLTs
199
Table 14-5. Comparison of EPON components for ONU
201
Table 14-6. Comparison of GPON components for OLT
203
Table 14-7. Comparison of GPON gateway processors
204

 
       
      © 2002-2007 The Linley Group