| List of Figures |
ix |
| List of Tables |
xi |
| About the Authors |
xiii |
| About the Publisher |
xv |
| Preface |
xvii |
| Executive
Summary |
xix |
|
|
| Chapter
1. Processor Technology |
1 |
Processor Basics |
1 |
CPU
Microarchitecture |
5 |
Main
Memory |
13 |
I/O
and Network Interfaces |
16 |
| Chapter
2. Embedded Applications |
21 |
| Networking
and Communications Equipment |
21 |
| Control
Plane vs. Data Plane |
21 |
| Control-Plane
Processing |
23 |
| Data-Plane
Applications |
24 |
| Services
Cards |
24 |
| Networked
Storage and RAID Controllers |
25 |
| Security |
26 |
| Broadband Infrastructure |
27 |
| Wireless Base Stations |
27 |
| Consumer
Electronics |
28 |
| Set-Top Boxes |
29 |
| Home Networking |
29 |
| Digital Photo Frame |
30 |
| IP Phone |
30 |
| IP Camera |
31 |
| High-Speed
Printers |
32 |
| PC-Like
Applications |
33 |
| Industrial
Control, Medical, and Military |
34 |
| Chapter
3. Standard Instruction Sets |
35 |
| Architecture Comparison |
35 |
| Technology |
35 |
| Market Position |
36 |
| x86
Instruction Set |
37 |
| Background |
37 |
| Initial
Instruction Set |
38 |
| Recent
Extensions |
38 |
| MIPS
Instruction Set |
39 |
| Background |
39 |
| Initial
Instruction Set |
40 |
| Recent
Extensions |
41 |
| PowerPC
Instruction Set |
42 |
| Background |
42 |
| Initial
Instruction Set |
44 |
| ARM
Instruction Set |
45 |
| Background |
45 |
| Instruction Set |
46 |
| Recent
Extensions |
46 |
| Chapter
4. High-Speed
Processors |
49 |
| What
Is a High-Speed Embedded Processor? |
49 |
| What is Not a High-Speed Embedded Processor |
50 |
| Common Characteristics |
50 |
| Standalone vs. Integrated Processors |
50 |
| Encryption Engines |
52 |
| RAID and Other Storage Engines |
52 |
| Packet-Processing Accelerators |
53 |
| Benchmarks |
53 |
| CPU Benchmarks
|
54 |
| Security Performance |
55 |
| Chapter
5. Technology and Market Trends |
57 |
| Technology
Trends |
57 |
| Multicore |
57 |
| CPU Complexity |
58 |
| Memory Access |
59 |
| Integration Trends |
59 |
| Specialized Accelerators and On-Chip Interconnects |
60 |
| Embedded
vs. Communications Processors |
60 |
| Market
Overview |
61 |
| Market
Size by Vendor |
61 |
| Market
Share by Instruction Set Architecture |
65 |
| Market
Forecast |
66 |
| Chapter
6. AppliedMicro (AMCC) |
71 |
| Company
Background |
71 |
| Key
Features and Performance |
72 |
| Internal
Architecture |
75 |
| System
Design |
78 |
| Development
Tools |
79 |
| Product
Roadmap |
80 |
| Conclusions |
80 |
| Chapter
7. Cavium |
83 |
| Company
Background |
83 |
| Key
Features and Performance |
84 |
| Octeon |
84 |
| Econa |
88 |
| Internal
Architecture |
90 |
| Octeon |
90 |
| Econa |
92 |
| System
Design |
93 |
| Octeon |
93 |
| Econa |
96 |
| Development
Tools |
96 |
| Product
Roadmap |
97 |
| Conclusions |
98 |
| Chapter
8. Freescale |
101 |
| Company
Background |
101 |
| Key
Features and Performance |
102 |
| Low-Cost PowerQuicc II Pro Processors |
103 |
| Single-/Dual-Core PowerQuicc III and QorIQ Processors |
104 |
| Quicc Engine Processors |
105 |
| Dual-Core PowerQuicc and Multicore QorIQ Processors |
107 |
| Internal
Architecture |
110 |
| e300
CPU |
110 |
| e500
CPU |
111 |
| Security
Engines |
112 |
| Quicc
Engine |
113 |
| QorIQ P4 Architecture |
114 |
| System
Design |
115 |
| System Interfaces |
115 |
| Application Examples |
117 |
| Development
Tools |
119 |
| Product
Roadmap |
120 |
| Conclusions |
120 |
| Chapter
9. Intel |
123 |
| Company
Background |
123 |
| Key
Features and Performance |
124 |
| Nehalem-based Xeon Products |
124 |
| Penryn-based Xeon, Core2 Duo, and Celeron Processors |
126 |
| Atom Products |
128 |
| Internal
Architecture |
130 |
| System
Design |
134 |
| Penryn-based Xeon, Core2 Duo, and Celeron Processors |
134 |
| Nehalem-based Xeon Products |
136 |
| Atom-Based Systems |
137 |
| Development
Tools |
138 |
| Product
Roadmap |
138 |
| Conclusions |
140 |
| Chapter
10. Marvell |
143 |
| Company
Background |
143 |
| Key
Features and Performance |
144 |
| Internal
Architecture |
148 |
| System
Design |
150 |
| Development
Tools |
151 |
| Product
Roadmap |
152 |
| Conclusions |
153 |
| Chapter
11. NetLogic (RMI) |
155 |
| Company
Background |
155 |
| Key
Features and Performance |
156 |
| XLR
Processors |
156 |
| XLS
Processors |
158 |
| XLP
Processors |
159 |
| Internal Architecture |
160 |
| System
Design |
163 |
| Development
Tools |
166 |
| Product
Roadmap |
166 |
| Conclusions |
166 |
| Chapter
12. Tilera |
169 |
| Company
Background |
169 |
| Key
Features and Performance |
169 |
| Internal
Architecture |
171 |
| System
Design |
173 |
| Development
Tools |
174 |
| Product
Roadmap |
174 |
| Conclusions |
175 |
| Chapter
13. Other Vendors |
177 |
| AMD |
177 |
| Company
Background |
177 |
| Key
Features and Performance |
178 |
| Conclusions |
180 |
| Broadcom |
181 |
| Company
Background |
181 |
| Key
Features and Performance |
182 |
| Conclusions |
184 |
| IBM |
184 |
| LSI |
185 |
| Company
Background |
185 |
| Key
Features and Performance |
186 |
| Conclusions |
187 |
| PMC-Sierra |
188 |
| Ubicom |
189 |
| Company
Background |
189 |
| Key
Features and Performance |
189 |
| Design Details |
191 |
| Conclusions |
191 |
| Via |
192 |
| Company
Background |
192 |
| Key
Features and Performance |
193 |
| Conclusions |
195 |
| Chapter
14. Processor Comparisons |
197 |
| Sub-3W
Processors |
198 |
| Performance |
199 |
| Interfaces |
199 |
| Conclusions |
202 |
| 3-7W
Processors |
203 |
| Performance |
205 |
| Interfaces |
207 |
| Conclusions |
208 |
| 7-20W
Processors |
209 |
| Performance |
209 |
| Interfaces |
211 |
| Conclusions |
212 |
| 20-30W
Processors |
214 |
| Performance |
215 |
| Interfaces |
217 |
| Conclusions |
218 |
Processors Consuming More Than 30W |
219 |
| Chapter
15. Conclusions |
221 |
| Market
Trends |
221 |
| Wireless Infrastructure |
221 |
| Networking Data Plane and Security |
222 |
| Printers |
222 |
| Consumer Opportunities |
223 |
| Kiosks and Digital Signs |
223 |
| Vendor Outlook |
224 |
| Closing Thoughts |
228 |
| |
|
| Appendix:
Further Reading |
229 |
| Index |
231 |