| Table 2-1. |
OSI reference model |
11 |
| Table 2-2. |
Bandwidth of common interfaces |
13 |
| Table 2-3. |
ITU-T standards for ATM adaptation layers |
18 |
| Table 2-4. |
IETF RFCs for IP encapsulation over ATM |
18 |
| Table 2-5. |
ATM Forum specifications for voice-over-ATM |
19 |
| Table 4-1. |
Preliminary 2007 NPU market share by revenue |
46 |
| Table 5-1. |
Key parameters for selected AMCC nP devices |
58 |
| Table 5-2. |
Interface configuration options for AMCC nP3705 |
59 |
| Table 6-1. |
Key parameters for Bay Microsystems network processors |
68 |
| Table 7-1. |
Key parameters for Broadcom NPU and TM devices |
77 |
| Table 8-1. |
Key parameters for EZchip NPU/TM devices |
87 |
| Table 9-1. |
Key parameters for LSI APP devices |
96 |
| Table 9-2. |
LSI APP650/APP3300 protocol and interworking support |
102 |
| Table 10-1. |
Key parameters for Intel IXP network processors |
107 |
| Table 11-1. |
Key parameters for Wintegra WinPath devices |
117 |
| Table 11-2. |
Wintegra protocol and interworking support |
123 |
| Table 12-1. |
Key parameters for selected Xelerated NPUs |
128 |
| Table 13-1. |
Key parameters for Ethernity ENET devices |
139 |
| Table 13-2. |
Ethernity ENET3000 family I/O options |
140 |
| Table 13-3. |
Ethernity protocol and interworking support |
142 |
| Table 13-4. |
Key parameters for Hifn 5NP4G device |
143 |
| Table 13-5. |
Key parameters for Mindspeed TSP3 family |
148 |
| Table 13-6. |
Mindspeed TSP3 protocol and interworking support |
150 |
| Table 13-7. |
Key parameters for TranSwitch Diplomat |
152 |
| Table 14-1. |
Key parameters for access NPUs |
157 |
| Table 14-2. |
Key parameters for OC-48 NPUs |
159 |
| Table 14-3. |
Key parameters for 10–40Gbps
NPUs |
162 |
| Table 14-4. |
Sample 2x10GbE
line cards |
163 |