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Mobile and Wireless Reports:

We provide comprehensive technology analysis on semiconductors for mobile and wireless applications in two primary categories: processing and connectivity. Processing includes cellular baseband chips, mobile application processors, and mobile multimedia processors (MMP). Mobile connectivity encompasses the noncellular radios commonly used in mobile devices: Bluetooth, FM, GPS, Wi-Fi and near-field communications (NFC).

Report Abstracts
 
Application Processors
 
A Guide to Mobile Processors, 2nd Edition                                          Published Dec. 2009
  This report covers application and multimedia processors designed for handheld equipment. Companies covered include Texas Instruments (OMAP), Marvell (Armada and Tavor), Qualcomm (MSM7000 and SnapDragon), Broadcom, Freescale (i.MX), Intel (Atom), NetLogic (Alchemy), Nvidia (Tegra), Renesas (SH-Mobile and SH-Navi), Samsung, ST-Ericsson (U8500), STMicroelectronics (Cartesio), Anyka, Core Logic, MtekVision, and Telechips.
 
Baseband Processors
 
A Guide to Wireless Handset Processors, 4th Edition                        Published Jun. 2009
  This report examines cellular baseband processors that target ultra-low-cost phones, basic phones, feature phones, smartphones, and data cards (modems). Vendors include Broadcom, Infineon, MediaTek, Qualcomm, and ST-Ericsson. Also covered are Icera, Renesas, Spreadtrum, and more.
 
Connectivity/Combo Chips
 
A Guide to Mobile Connectivity Chips, 3rd Edition                               Published Mar. 2010
  This report covers Bluetooth, Wi-Fi, FM, and GPS chips that target mobile devices, including cell phones, PDAs, media players, and other handheld devices. Vendors include Atheros, Broadcom, CSR, Marvell, Qualcomm, ST-Ericsson, and Texas Instruments. It also covers vendors with a more limited presence in mobile connectivity: CellGuide, HelloSoft, Infineon, Intel, MediaTek, Nanoradio, Redpine, Silicon Labs, Skytraq, and Telechips.
 
CPU Cores and IP
 
A Guide to CPU Cores and Processor IP, 2nd Edition                     To be pub. Mar. 2010
  This report covers intellectual property (IP) cores that can be used in networking and communications system-on-a-chip (SoC) and ASIC designs. The report focuses on CPU, DSP, graphics, and video engine cores from vendors such as ARM, MIPS, Imagination Technologies, Tensilica, CEVA, VeriSilicon (ZSP), Vivante, and On2 (Hantro).
 
Mobile TV Chips
 
A Guide to Mobile TV Chips, 1st Edition                                                   Published Sep. 2007
  This report covers the emerging mobile television market including chips for MediaFLO, T-DMB, and DVB-H. Covered vendors include DiBcom, Siano, Texas Instruments, Analog Devices (Integrant), Telegent, Afa Technologies, and more.
 
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