A Guide to Wireless Handset Processors, Third Edition
			Table of Contents
	Return to Report Page		Preface xix Executive Summary xxi   Chapter 1.   Wireless Handsets 1         Types of Handsets 1              Ultra-Low-Cost Phones 2              Basic Phones 2              Feature Phones 3              Smartphones 5              Cellular Data Cards 5         Cellular Networks 6         Cellular Technologies 8              2G Technologies 8              2.5G Technologies 10              3G Technologies 11              HSDPA 12              HSPA and HSPA+ 13              4G Technologies 15 Chapter 2.   Handset-Processor Technology 19         CPU Microarchitecture 19              Instruction Issue 19              Pipelining and Penalties 20              Branch Prediction 21              Caches 21         Security Standards 22              Encryption 22              Hashing 23         Multimedia Standards 23              Screen Sizes and Frame Rates 23              Audio Codecs 25              Video Codecs 26              Digital Rights Management 27              Mobile Digital TV 28         Standard Interfaces 29              PCMCIA and CompactFlash 30              SPI and UART 30              Memory Cards 30              Audio Interfaces 31              Video Interfaces 31              RF Interfaces 32              Sensors and Displays 32              USB and Wireless USB 32              Wi-Fi 33              Bluetooth 34         Testing 35 Chapter 3.   Handset Processors 37         What is a Handset Processor? 37         Common Characteristics 39              CPU Complex 39              Baseband DSP 40              Multimedia Engines 41              Security Engine 43              Internal Memory 44              Memory Controllers 44              Memory Cards 45              LCD, Keypad, and Touch-Screen Controllers 45              System Interfaces 46              Power Management 47              RF Functions 47              Packaging 47          Handset System Design 48              Feature Phone Design 48              High-End Phone Design 50              Component Pricing 50         ARM CPUs 51              ARM Instruction Set 52              ARM CPU Cores 53         Graphics Cores 55              ARM Mali 55               PowerVR 55         Ceva DSPs 56 Chapter 4.   Market Size and Trends 59         Market Size and Share 59              Handset Market 59              Cellular Data Cards 61              Baseband-Processor Market 62              UMTS Processor Market 64         Market Trends and Forecast 65              Handset and Data-Card Forecast 65              Baseband-Processor Forecast 67              Air Interfaces 67              Smartphones 70              Handset Features 71         Handset Technology Trends 73              Camera Phones 73              Web Browsing and Email 74              Mobile Video 74              3D User Interfaces 75              Screen Size and Resolution 75              Touch Screens and Other Sensors 76              Wi-Fi Phones 76              Noice-Canceling Microphones 77              Dual-SIM Phones 77         Processor Technology Trends 78              Integration 78              Multicore Design 79              Connectivity 80 Chapter 5.   Broadcom 81         Company Background 81         Key Features and Performance 83         Internal Architecture 84         System Design 85         Product Roadmap 87         Conclusions 87 Chapter 6.  EMP (Ericsson) 89         Company Background 89         Key Features and Performance 90         Design Details 92         Development Tools 93         Product Roadmap 94         Conclusions 94 Chapter 7.   Freescale 97         Company Background 97         Key Features and Performance 98         Internal Architecture 99              CPU and Multimedia Subsystem 99              Security Features 100              Baseband Subsystem 100         System Design 101         Development Tools 102         Product Roadmap 103         Conclusions 103 Chapter 8.   Infineon 105         Company Background 105              Corporate 105              Handset Products 106         Key Features and Performance 107              GSM/GPRS Processors 107              EDGE Processors 109              UMTS Processors 111         Internal Architecture 111         System Design 113         Development Tools 115         Product Roadmap 115         Conclusions 116 Chapter 9.   Marvell 119         Company Background 119         Key Features and Performance 120         Internal Architecture 121         System Design 122         Development Tools 123         Product Roadmap 124         Conclusions 124 Chapter 10.   MediaTek 127         Company Background 127         Key Features and Performance 128              MT Baseband Processors 128              SoftFone Baseband Processors 130         Design Details 131              MT Baseband Processors 131              SoftFone Baseband Processors 133         Conclusions 134 Chapter 11.   Qualcomm 137         Company Background 137              Corporate 137              Handset Products 138         Key Features and Performance 139              Basic Phones 139              Feature Phones 140              Smartphones 141              Data Cards 143         Internal Architecture 143         System Design 145         Development Tools 146         Product Roadmap 147         Conclusions 148 Chapter 12.   Renesas 151         Company Background 151         Key Features and Performance 152         Internal Architecture 154         System Design 156         Product Roadmap 157         Conclusions 157 Chapter 13.   ST-NXP 159         Company Background 159         Key Features and Performance 161              GSM/GPRS Processors 161              Edge Processors 161              3G Processors 162         Internal Architecture 164              ULC Processors 164              Dual-DSP Midrange and High-End Processors 164              Single-DSP Midrange and High-End Processors 166         System Design 166              ULC Processors 166              Midrange and High-End Processors 166         Development Tools 167              Software and Services 167              Platforms 168         Product Roadmap 168         Conclusions 169 Chapter 14.   Texas Instruments 171         Company Background 171         Key Features and Performance 172         Internal Architecture 175         System Design 176         Development Tools 177         Product Roadmap 178         Conclusions 178 Chapter 15.   Other Baseband Processors 181         Minor Vendors 181              Commsys 181              Eonex 181              Infomax 182              T3G 182              Via Telecom 182         Icera 183              Company Background 183              Key Features and Performance  184              Conclusions 185         InterDigital 186              Company Background 186              Key Features and Performance  187              Conclusions 189         Spreadtrum 190              Company Background 190              Key Features and Performance  191              Conclusions 193 Chapter 16.   Comparing Handset Processors 195         Ultra-Low-Cost (ULC) Phones 196         Basic Phones 198         2G Feature Phones 201         3G Feature Phones 205         High-End Feature Phones 208         3G Smartphones 210         TD-SCDMA Handsets 213         Data Cards 213 Chapter 17.   Conclusions 215         Market and Technology Directions 216              Device Types 216              Air Interface Trends 216              Emerging Features 217         Top Handset Processors 218         Vendor Outlook 219   Appendix: Further Reading 225 Index 227   List of Figures List of Tables
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