| Preface |
xv |
| Executive
Summary |
xvii |
| |
|
| Chapter
1. Handset Connectivity |
1 |
| Types
of Handsets |
1 |
| Mobile
Wi-Fi Applications |
2 |
| Wi-Fi
in Smartphones |
3 |
| Wi-Fi
in Handsets |
3 |
| Types
of Wi-Fi Handsets |
4 |
| Other
Mobile Wi-Fi Applications |
5 |
| Wi-Fi
Overview |
5 |
| Wi-Fi
Alliance |
6 |
| 802.11
Modes |
6 |
| Other
Connectivity Technologies |
7 |
| Bluetooth |
7 |
| GPS |
9 |
| FM
Radio |
9 |
| NFC |
10 |
| Mobile
TV |
10 |
| Chapter
2. Wi-Fi Technology |
11 |
| 802.11
Radio Design |
11 |
| Baseband |
11 |
| RF
Transceivers |
12 |
| RF
Front-End Modules |
14 |
| Radio
Coexistence |
15 |
| MIMO
Background |
16 |
| Spatial
Division Multiplexing |
16 |
| Space-Time
Block Coding (STBC) |
16 |
| Maximum-Ratio
Combining (MRC) |
17 |
| 802.11
Protocols |
17 |
| QoS
(802.11e) |
17 |
| Power
Save (802.11e) |
18 |
| Security
(802.11i) |
18 |
| Internationalization
(802.11d, 802.11h, 802.11j) |
19 |
| High
Throughput (802.11n) |
19 |
| Roaming
(802.11i, 802.11r, 802.11u) |
20 |
| Fixed
Mobile Convergence |
20 |
| Chapter
3. Wi-Fi Chip Design |
23 |
| What
is a Mobile Wi-Fi Chip? |
23 |
| What
is a Connectivity Chip? |
23 |
| Typical
Mobile Wi-Fi Chip |
24 |
| Byte’s-Eye
View |
25 |
| Wi-Fi
Chip Design |
26 |
| MAC
Design |
26 |
| VoWLAN
Support |
27 |
| Baseband
Design |
27 |
| Power
Considerations |
27 |
| Semiconductor
Technologies |
28 |
| Component
Packaging |
29 |
| Chapter
4. Market Size and Trends |
31 |
| Market
Size and Share |
31 |
| Handset
Market |
31 |
| Smartphones |
32 |
| Connectivity
Features |
33 |
| Wi-Fi
in Handsets |
34 |
| Other
Embedded Wi-Fi Markets |
35 |
| Handset
Wi-Fi Market Share |
36 |
| Handset
Bluetooth Market |
37 |
| Cellular
Baseband Market |
38 |
| Handset
Wi-Fi Technology Trends |
38 |
| Wi-Fi/Bluetooth
Connectivity Chips |
38 |
| Integrating
Other Radios |
39 |
| Cellular
Baseband Integration |
40 |
| Multichip
Modules |
41 |
| 5GHz
Wi-Fi |
42 |
| UMA
and FMC |
42 |
| Chapter
5. Atheros |
45 |
| Company
Background |
45 |
| Key
Features |
46 |
| Design
Details |
47 |
| Conclusions |
48 |
| Chapter
6. Broadcom |
51 |
| Company
Background |
51 |
| Key
Features |
52 |
| Design
Details |
53 |
| Conclusions |
55 |
| Chapter
7. Conexant |
57 |
| Company
Background |
57 |
| Key
Features |
58 |
| Design
Details |
59 |
| Conclusions |
60 |
| Chapter
8. CSR |
61 |
| Company
Background |
61 |
| Key
Features |
61 |
| Design
Details |
63 |
| Conclusions |
63 |
| Chapter
9. Marvell |
65 |
| Company
Background |
65 |
| Key
Features |
66 |
| Design
Details |
67 |
| Conclusions |
68 |
| Chapter
10. NXP |
69 |
| Company
Background |
69 |
| Key
Features |
70 |
| Design
Details |
71 |
| Conclusions |
72 |
| Chapter
11. STMicroelectronics |
75 |
| Company
Background |
75 |
| Key
Features |
77 |
| Design
Details |
77 |
| Conclusions |
78 |
| Chapter
12. Texas Instruments |
81 |
| Company
Background |
81 |
| Key
Features |
82 |
| Design
Details |
83 |
| Conclusions |
85 |
| Chapter
13. Other Vendors |
87 |
| Atmel |
88 |
| Company
Background |
88 |
| Key
Features |
88 |
| Conclusions |
89 |
| Freescale |
90 |
| Infineon |
91 |
| MediaTek |
92 |
| Conclusions |
92 |
| Nanoradio |
93 |
| Company
Background |
93 |
| Key
Features |
93 |
| Conclusions |
94 |
| Qualcomm |
95 |
| Company
Background |
95 |
| Connectivity
Products |
95 |
| Conclusions |
96 |
| Redpine |
97 |
| Company
Background |
97 |
| Key
Features |
97 |
| Conclusions |
98 |
| Chapter
14. Comparing Mobile Wi-Fi Chips |
99 |
| Partitioning |
100 |
Standalone
Wi-Fi Chips
|
101 |
| Connectivity
Chips |
104 |
Connectivity
Portfolio
|
107 |
| Chapter
15. Conclusions |
109 |
| Market
Directions |
109 |
| Technology
Trends |
110 |
| Vendor
Outlook |
111 |
| Appendix:
Further Reading |
113 |
| Index |
115 |
| |
| List of Figures |
| List of Tables |