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Session 0: Keynote
Mobile Market Overview Linley Gwennap, Principal Analyst, The Linley Group
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172 KB |
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Session 1: Application Processing
System Integration on the Snapdragon Mobile Processor Raj Talluri, VP of Product Management, Qualcomm
Optimized Software on ARM Cortex Processors Travis Lanier, Product Manager, Processor Division, ARM
Analyzing the Ingredients of a Portable Mobile Device Benchmark Markus Levy, President, EEMBC
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6.7 MB |
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Session 2: Mobile Security
Device Security: A Checklist for Designers James Burns, Sr. Member of Technical Staff, Mocana
Embedded Security in Connected Mobile Devices Bart Stevens, Director of Product Management, AuthenTec
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9.6 MB |
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Session 3: Mobile SoC Design
A New Multi-Time Programmable Embedded NVM IP Lee Cleveland, VP of Engineering, Kilopass
CEVA-XC - Vector DSP for Software-Defined Radio CEVA
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2.5 MB |
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Session 4: Image Processing
Computer Vision in Mobile Devices: The Next Killer App? Jeff Bier, President and Cofounder, BDTI
Building Advanced Natural User Interfaces for Mobile Devices Veera Manikandan Raju, Engineering Manager, Texas Instruments
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1.3 MB |
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Session 5: Wireless Subsystem Design
A Monolithic 'Mobile MIMO' Wi-Fi/BT/FM Combo Chip Cesar A. Johnston, VP Engineering for Wireless Connectivity, Marvell
Benchmarking 4G Solutions for Mobile Devices Sebastien Falgayrettes, Product Management, Sequans
Advantages of Hardware Multithreading In Modem Processing Amit Rohatgi, Principal Architect, MIPS Technologies
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2.4 MB |
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Session 6: 3D Graphics
Advanced Graphics Engines for Multicore Application Processors Brian Murray, Graphics Architect, Freescale
ARM Mali-400 MP GPU, Bringing Visual Computing to Mobile Ian Smythe, Director of Marketing, Multimedia Processing Division, ARM
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3.2 MB |
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Session 7: Multimedia Processing
Parallelism with a Purpose - Balancing Efficiency vs. Flexibility in Mobile SoCs Steve Cox, VP Business Development, Target Compiler
1 TOPS/W Multicore Multimedia Processor David Moloney, CTO and Founder, Movidius
Evolving Voice and Audio Requirements for Smartphones Dror Maydan, Director of Software, Tensilica
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5.3 MB |
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Session 8: Mobile System Design
Optimizing Battery Life and Sideloading Performance with USB Tunneling Tim Saxe, CTO, QuickLogic
High-Density and Three-Dimensional Packaging in Mobile Systems David Carey, VP Technical Intelligence, UBM TechInsights
Smartphone Application Processor Companion Chips SiliconBlue Technologies
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6.5 MB |
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