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May 25, 2015

  • MT6797 Is a Perfect Ten (MCR)
    Combining 10 CPUs in three clusters, MediaTek’s Helio X20 offers the industry’s best CPU performance in a smartphone processor with integrated Category 6 LTE.
  • Arteris FlexNoC Gets Physical (MPR)
    Arteris is introducing FlexNoC Physical, a new version of its network-on-a-chip that strives to eliminate timing-closure problems. Using automated tools, it can insert pipeline stages in critical data paths between IP blocks.
  • Spreadtrum Crashes LTE Party (MCR)
    Spreadtrum may be late to the LTE party with its SC9830A, but the new chip’s high level of integration and performance may give it an edge over other low-cost quad-core processors.
  • Freescale Equips QorIQ for SDN/NFV (NWR)
    Freescale is offering pre-integrated software and reference designs for SDN and NFV. Partner Advantech provides a network-services switching platform that is OpenFlow 1.3 compliant.

May 18, 2015

  • Silicon Photonics Converge on QSFP28 (NWR)
    The small-form-factor QSFP28 package has recently emerged as the ideal 100Gbps data-center module for high faceplate density, spurring new efforts at silicon-photonics integration.

May 11, 2015

  • Haswell-EX Brings TSX to Servers (MPR)
    Intel’s 22nm Haswell-EX is a socket-compatible update to the Xeon E7 platform that significantly boosts performance and power efficiency while upgrading to DDR4 memory.
  • Broadcom Fills Switch-Roadmap Gaps (NWR)
    Broadcom has sampled Trident II+ (BCM56860), which it intends as a 28nm midlife kicker to the popular 40nm Trident II. The new switch adds support for 100GbE uplinks.
  • ARM Tunes Into Radio IP (MPR/MCR)
    ARM has acquired two suppliers of Bluetooth intellectual property. Sunrise developed the Cordio hard macro for Bluetooth LE, and Wicentric provides a Bluetooth protocol stack. 

May 4, 2015

  • Centec Bridges to Data Center (NWR)
    Offering 10G, 40G, and 100G Ethernet ports, Centec’s new GoldenGate switch IC targets top-of-rack (ToR) and leaf /spine applications in data centers, where it will face Broadcom’s Trident family.
  • Cadence Fuses IP for IoT, Wearables (MCR)
    Cadence’s new Fusion IP combines elements from its Xtensa RISC CPUs, HiFi 3 audio DSPs, and ConnX bit-stream processors into a complete subsystem for wireless sensor nodes.
  • Titan X: 50% More Maxwell (MPR)
    Nvidia’s Titan X, a GPU based on its Maxwell architecture, uses a monster-sized 600mm2 die with 3,072 shaders to deliver 40% more performance than its predecessor.

April 27, 2015

  • Ceva Sharpens Computer Vision (MPR/MCR)
    The new Ceva-XM4 vision-processor core improves on the performance and power efficiency of its fixed-point predecessor, the Ceva-MM3101, through new FPUs, wider VLIW instructions, and other enhancements.
  • Freescale Upgrades Automotive Vision (MPR)
    Freescale’s S32V234 is the first member of a new processor family for advanced driver-assistance systems (ADAS). It integrates four ARM Cortex-A53 CPUs and two Cognivue Apex computer-vision cores.
  • Operators Prepare to Deploy LTE-U (NWR/MCR)
    Qualcomm is set to receive a boost from planned LTE-U deployment by Verizon and T-Mobile. But other operators, such as AT&T, are more cautious, preferring instead to wait for 3GPP standards. 
  • IoT-Specific Processors Emerge (MPR/MCR)
    A new class of processors is emerging that targets the Internet of Things and wearables. These markets are growing rapidly; we are bullish on wearables, but our forecast for IoT is more conservative than most.

April 20, 2015

  • PMC Mapper Drives OTN Density (NWR)
    PMC-Sierra’s new Digi-G4 is the industry’s first 400Gbps OTN processor, overtaking products from AppliedMicro and Inphi (Cortina). But Altera and Xilinx offer alternatives using multiple FPGA generations.
  • Editorial: Moore’s Law Turns 50 (MPR)
    Gordon Moore’s prediction has had a good run, but nothing lasts forever. Transistor progress is slowing and has even halted at some price points. The industry must adapt.

April 13, 2015

  • Synopsys Embeds Vision Processing (MPR)
    The new DesignWare EV licensable IP combines ARC CPUs with programmable accelerators to boost the performance of computer-vision algorithms. It includes an object-detection engine optimized for convolutional neural networks.
  • Qualcomm Scans Fingerprints in 3D (MCR)
    Qualcomm’s new Sense ID technology is the first fingerprint sensor for smartphones that uses ultrasonics to reduce false negatives and improve security over capacitive technologies.

April 6, 2015

  • Broadcom Fabric Scales to 100Tbps (NWR)
    The 28nm StrataDNX chipset represents the fourth-generation Dune Networks design. Broadcom added a standalone Ethernet switch chip that enables deep packet buffers and external table expansion.
  • Intel 7360 Nears LTE Lead (MCR)
    Hot on Qualcomm’s heels, Intel is nearing production on its Category 10 LTE platform, the XMM 7360. The chipset could appear in flagship smartphones from Samsung and Apple.
  • Graphics APIs Reach a New Low (MPR)
    The Khronos Group is attempting to bring console-style graphics programming to new platforms. Its Vulkan is a new low-level graphics API that will run on multiple GPUs and operating systems.
  • Luxtera Debuts PSM4 Module at OFC (NWR)
    At the recent Optical Fiber Communications conference, Luxtera showed samples of an optical module implementing the 100G PSM4 multisource agreement in a QSFP28 package.

March 30, 2015

  • 14nm Xeon D Secures the Data Center (MPR)
    Intel’s first 14nm server processor, Xeon D integrates eight Broadwell CPUs and achieves up to 3.4x greater performance than Atom microserver processors, blocking potential ARM-based competitors.
  • Marvell LTE Reaches Category 7 (MCR)
    Marvell has advanced its LTE capabilities with the new PXA1826, a thin modem that uses carrier aggregation to achieve speeds of 300Mbps. The company also earned a significant win at Samsung.
  • Kandou Narrows Focus to Serdes IP (NWR)
    Kandou Bus is targeting communications customers with the Glasswing family of serdes IP, the first member of which is a 125Gbps hard macro implementing the company’s 5-bit over 6-wire protocol.

March 23, 2015

  • Galaxy S6 Shows New Technologies (MCR)
    The new Galaxy S6 is a trendsetting smartphone that includes emerging technologies such as UFS, LPDDR4, 2x2 Wi-Fi, and wireless charging, plus the industry’s first 14nm application processor, the Exynos 7420.
  • Flex Logix Promotes FPGA IP (NWR)
    A startup has developed a hierarchical switching matrix for FPGAs based on work from UCLA. Flex Logix is licensing these IP blocks to semiconductor companies.
  • Editorial: NXP Deal Builds Auto Giant (MPR)
    NXP’s pending acquisition of Freescale will shake up the microcontroller market, particularly in the automotive segment, but Freescale’s networking processors could be up for grabs.

March 16, 2015

  • UltraScale+ Adopts 16nm FinFETs (NWR)
    Xilinx has introduced Kintex and Virtex FPGA families, as well as a Zynq MPSoC, in an UltraScale+ architecture based on TSMC’s 16nm FinFET process. It also launched SDSoC, a compiler tool that eases Zynq development.

March 9, 2015

  • Octeon Fusion-M Goes Macro (MPR/NWR)
    Cavium has launched a new Octeon Fusion lineup that extends its integrated wireless-base-station processors to macrocells and supports more users than competing products.
  • Cadence HiFi 4 Creates 3D Sound (MPR)
    Extending Cadence’s family of licensable audio DSP cores, HiFi 4 can process complex object-based surround-sound algorithms such as Dolby Atmos and DTS-X.

March 2, 2015

  • Spreadtrum Nears RDA Merger (MCR)
    Rising low-end shipments helped boost Spreadtrum’s revenue as it prepares to merge with RDA, but the company hopes new LTE chips will improve its average selling price.

February 23, 2015

  • AMD Unearths Excavator CPU (MPR)
    Using the new Excavator CPU, AMD’s Carrizo processor delivers more performance and features than its predecessor, despite sticking with 28nm technology. Carrizo-L extends the line downward.

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