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May 28, 2018

  • Snapdragon 710 Jumps to Cortex-A75
    Debuting the new 700-series for mid-premium smartphones, Qualcomm brings 10nm technology and its newest CPU, based on Cortex-A75, to this lower price range.
  • MT3620 Runs Azure Sphere for IoT
    The first processor compatible with the new Azure Sphere operating system, the MT3620 is an unusually powerful IoT chip with five CPUs, Microsoft’s Pluton security engine, and integrated Wi-Fi.
  • QuickLogic Gives IoT Sensors a Brain
    The QuickAI hardware-development kit combines the EOS-S3 sensor hub with two NeuroMem neural-network chips. It enables trainable pattern recognition in images, speech, text, and video, as well as complex data.

May 21, 2018

  • ThunderX2 Strengthens ARM Servers
    Cavium’s new 32-core server processor features the most powerful ARM CPU yet to reach production, delivering plenty of performance for data centers and HPC.
  • BrainChip Aims to Spike Neural Nets
    BrainChip specializes in neuromorphic processing that employs spiking neural networks. It offers the technology in an FPGA and is developing an SoC implementation called Akida.

May 14, 2018

  • MIPS I7200 CPU Dons New Threads
    The new MIPS I7200 is a licensable 32-bit CPU optimized for multithreaded real-time control in LTE-Advanced and 5G modems as well as Wi-Fi router and gateway chips.
  • 10nm Problems Slip Ice Lake to 2019
    Intel has delayed its 10nm volume production until next year, pushing out Ice Lake. To fill the hole in the PC-processor roadmap, it added Whiskey Lake, a 14nm product that targets laptops.
  • Editorial: Intel Foundry Flounders
    Intel launched a third-party manufacturing business in 2010 with great expectations of challenging TSMC, but the ongoing delays in its 10nm process may kill this business.

May 7, 2018

  • Ryzen 2 Is First 12nm PC Processor
    AMD’s first Ryzen 2 products, code-named Pinnacle Ridge, offer competitive performance and excellent value in high-end desktop PCs for gamers and content creators.
  • New Wireless MCUs Bolster IoT
    The latest wireless microcontrollers from NXP, STMicroelectronics, and Texas Instruments integrate multiple radios and strengthen security, promising better IoT designs.
  • TI Builds First Automotive-Radar SoCs
    Texas Instruments is the first to reach production with automotive-radar SoCs that combine digital signal processing with the RF front end, all in a single 45nm RF-CMOS chip.

April 30, 2018

  • Broadcom Switch Blends 4G/5G Radios
    Broadcom is sampling Monterey, an Ethernet switch chip that uniquely enables CPRI ports for 4G-cellular fronthaul as well as new Ethernet-based protocols for 5G fronthaul.
  • Editorial: China’s AI Dream
    The AI-accelerator market is wide open, but to achieve its plan to dominate the world in this technology, China needs more than just government-funded startups selling to other domestic companies.
  • Ceva First to Launch 802.11ax IP
    Ceva is offering 802.11ax additions to its RivieraWaves Wi-Fi family. Its new RW-AX-series targets a range of products that spans IoT/wearables, mobile devices, access points, and gateways.

April 23, 2018

  • Exynos 9810 Shows Powerful New CPU
    Benchmarks verify that Samsung has delivered a massive performance boost in the Exynos 9810. The company also announced the Exynos 9610, the industry’s first 10nm processor for mainstream smartphones.
  • Efinix Samples Its First FPGAs
    The FPGA startup has delivered on its promises of greater gate density and lower power. The initial products target small mobile applications, but larger chips will sample later this year.
  • Cadence Q6 DSP Merges AI and Vision
    The new Vision Q6 core combines computer-vision, image-processing, and neural-network functions. A revamped 13-stage pipeline helps boost performance by 50% over the earlier Vision P6 design.

April 16, 2018

  • TSMC 7nm Approaches Intel’s Prowess
    As Intel struggles to put its 10nm manufacturing into production, TSMC and other foundries are preparing 7nm processes that match up well against the traditional fab-technology leader.
  • Arm Kigen Aims to Secure Cellular IoT
    Arm wants to replace discrete subscriber identity modules (SIMs) in cellular IoT devices with iSIMs that designers can build directly into the main processor, reducing cost and enhancing security.

April 9, 2018

  • Intel Adds Cores to Core Processors
    Intel greatly expanded its lineup of 8th Generation processors with 30 new models that raise the core or thread count for nearly all Core i3, Core i5, and Core i7 buyers.
  • Clockless Cortex-M3 Cuts Power
    Startup Eta Compute has implemented an Arm Cortex-M3 in asynchronous logic. Licensable as a 55nm hard macro, it’s designed for low-power SoCs, and it also runs an unusual neural network.

April 2, 2018

  • Abee Adds AI to Wearables Processor
    A wearables-processor startup, funded by parent Huami, has developed a unique SoC featuring a tiny AI engine that reduces power by 23x when running neural networks.
  • Microsemi Pushes OTN to Terabits
    Microsemi’s Digi-G5 is the industry’s first OTN framer/mapper chip to handle 400G Ethernet as well as Flex Ethernet (FlexE). It combines up to 1.2Tbps of bandwidth and unprecedented flexibility.
  • Mali-G52 Boosts Mainstream Phones
    Targeting midrange and low-cost smartphones, Arm’s new cores include the Mali-G52 and Mali-G31 GPUs, the Mali-V52 video codec, and the Mali-D51 display processor.

March 26, 2018

  • Nvidia Shares Its Deep Learning
    Competing with DLA IP vendors, Nvidia has extracted the deep-learning accelerator from its Xavier autonomous-driving processor and is offering it under a royalty-free open-source license.
  • NXP Pushes i.MX8M Mini to 14nm
    The company’s first 14nm chips, NXP’s new i.MX8M Mini products are lower-cost versions of some i.MX8 media processors, and some will supersede existing i.MX6 models. 
  • IC Economics Limit Performance
    New process nodes no longer allow doubling of transistor budgets at the same cost, constraining designers to small increases in transistor budget and declining die sizes.
  • Marvell Doubles PAM4 PHY Density
    Marvell is sampling its first 50Gbps PAM4 PHY, which targets systems rather than optical modules. The 88X7120 arrives at the same time as the first 400G Ethernet switch chips.
  • NXP Refits i.MX and Kinetis for IoT
    NXP has unveiled two new IoT processor families: i.MX chips with package-on-package wireless modules, and Kinetis K32W0x-series microcontrollers with integrated radios.

March 19, 2018

  • AMD Embeds Graphics in Ryzen
    The four Ryzen Embedded V1000 chips are AMD’s first Zen-based embedded processors with integrated graphics. Their Vega GPU cores offer an upgrade over previous products.
  • Huawei Joins 5G Modem Race
    Huawei may be the first to production with a 5G modem, the Balong 5G01. That ASIC, due out later this year, targets fixed-wireless broadband and similar devices.
  • Spreadtrum Extends Intel Alliance
    China’s leading mobile-processor supplier, with help from Intel, plans to develop a 5G chipset for next-generation smartphones, targeting production in 2H19.

March 12, 2018

  • Broadcom Router Chips Aim at ASICs
    As the 16nm StrataDNX generation, Jericho2 and Ramon deliver 400G Ethernet support and unprecedented port density using 50Gbps PAM4 serdes as well as in-package HBM.
  • Xeon D Soars With Skylake
    Intel’s new Xeon D-2100 SoCs have upgraded to the Skylake-SP CPU. They also double the DRAM bandwidth and the 10GbE port count, and some have QuickAssist cryptography acceleration.
  • Ceva PentaG Adds AI to 5G Baseband
    Ceva’s new PentaG DSP comprises a set of configurable processing blocks that allow designers to build digital basebands implementing the recently ratified 3GPP 5G-NR specification.
  • Helio P60 Targets “New Premium”
    MediaTek is entering the emerging mid-premium smartphone segment with a powerful but affordable new processor that includes four Cortex-A73 CPUs and a Cadence AI accelerator.

March 5, 2018

  • Cambricon Leads China Into AI Chips
    A government-funded Beijing startup, Cambricon develops IP cores and processors for deep-learning acceleration. Among its first design wins is Huawei’s Kirin 970 smartphone processor.
  • Silicon Fingerprints From eMemory
    NeoPUF Entropy IP, from Taiwanese NVM vendor eMemory, enables chip designers to integrate a physical unclonable function (PUF) comprising 64K random nonvolatile bits.
  • Editorial: 5G Reaches Peak Hype
    Will 5G launch this year with ultrafast data rates and almost no latency to the cloud, eventually creating trillions of dollars in new revenue? Don’t believe everything you hear.
  • Snapdragon 820 Tapped for Embedded
    Qualcomm has added the Snapdragon 820E to an embedded lineup that already includes the 410E and 600E, offering a powerful yet low-power processor for demanding consumer and industrial designs.

February 26, 2018

  • RISC-V Enables IoT Edge Processor
    Startup Greenwaves has used a RISC-V CPU with DSP extensions to create a unique microcontroller plus parallel processor. It targets image and signal processing in battery-powered IoT nodes.

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