The Serval-2 Carrier Ethernet switch promises lower power and a lower price than competing products as well as MEF CE 2.0 readiness.
GlobalFoundries, TSMC, and other foundries are scrambling to catch up with Intel’s FinFET technology, and their processes are growing more complex and costly at 20nm and below.
Demonstrations of 100Gbps photonics by Cisco, Kotura, and OneChip are indicative of the industry's move towards photonic integrated circuits (PICs). PIC competition is heating up as data centers beckon with larger volumes.
Centec's new GreatBelt (CTC516x) offers a comprehensive Carrier Ethernet feature set for Gigabit and 10G Ethernet designs. It also adds enterprise features and reduces cost relative to the company’s shipping Humber switch chip.
MoSys has entered a new market with a gearbox PHY for 100G Ethernet. By offering decision-feedback equalization, the company is targeting line-card and long-reach applications.
After a long development period and multiple product generations, 10GbE-over-copper is finally ready for high-volume shipments. Aquantia and Broadcom have taken the early lead, but AppliedMicro and Marvell are targeting the next round of designs.
New processors from Broadcom and Mindspeed are expanding the options for cellular base-station designers, and other announcements from this year’s Mobile World Congress reaffirm the industry's interest in small-cell technology.
Altera has signed an agreement with Intel to manufacture its 14nm FPGAs. If the companies execute successfully, Altera will be in a position to win FPGA market share from archrival Xilinx.
MoSys has updated its Bandwidth Engine (BE) for 400Gbps line cards. The new BE-2 family increases the serial-interface rate and adds more intelligence.
Silicon photonics could be the foundation of next-generation interconnects in data centers and beyond. Luxtera, Intel, Kotura, and Cisco are among those developing 100Gbps optical interconnects.
LSI is the first to offer a 16-core ARM communications processor, the AXM5516. This device extends the company's Axxia line, previously based on PowerPC.
The new StrataXGS BCM56340 and BCM56547 unify wired and wireless networks with CAPWAP support. These GbE switch chips also improve integration, reducing the cost of stackable switches.
The battle for the wireless baseband heated up again as Ceva announced new features for its flagship XC family of licensable DSPs.
The Tile-Gx72 integrates 72 CPU cores, four DRAM controllers, two crypto accelerators, and more. Tilera's megachip targets networking, video coding, and other parallel-processing applications.
Broadcom has started designing its own ARM-compatible CPUs, which will eventually power the company's broadband and video processors, including set-top-box chips.