» Subscribe to Linley Newsletter

Linley Newsletter — Analysis of microprocessor and semiconductor developments

Our newsletter is free. To access entire articles please subscribe to Microprocessor Report.

This newsletter is published by The Linley Group, a leading provider of technology analysis and strategic consulting in semiconductors for a broad range of applications including networking, communications, mobile and wireless.

Most Recent | Archive: 2017   |   2016   |   2015

  August 22, 2017   Marvell Targets Automotive Networks
Marvell is challenging the automotive-networking leaders by offering two new chips: the 88W8987xA combines 802.11p, 802.11ac, and Bluetooth 5 wireless, and the 88Q5050 is a secure eight-port switch for intra-auto Gigabit Ethernet.
  August 22, 2017   Mellanox Accelerates BlueField SoC
Having 16 ARMv8 cores, two 100GbE ports, PCI Express Gen4, and NVMe-oF acceleration, Mellanox’s new BlueField processor is well equipped for high-speed networking and storage.
  August 22, 2017   Qualcomm Makes Play for Audiophiles
Two new Qualcomm chips improve audio quality over wireless connections. The CSR8675 targets wireless headphones, and the high-end CSRA68100 is well suited to wireless speakers.
  August 15, 2017   Broadcom Hits Smart NICs and Storage
Broadcom’s new BCM58800 processor family combines eight high-end ARM CPUs and accelerators to enable 100Gbps of throughput in smart NICs. It also targets NVMe Over Fabrics in storage appliances.
  August 15, 2017   Exynos iT200 Targets Wi-Fi IoT Client
The new iT200 is the first Samsung Exynos chip purpose-built for wireless IoT clients. It integrates two ARM Cortex CPUs and a complete 802.11b/g/n single-band Wi-Fi radio.
  August 15, 2017   SPEC CPU2017 Updates Benchmarks
CPU2017 updates the rules, subtests, and scoring of the widely reported SPEC CPU2006 benchmark to reduce run times and more accurately measure the performance of modern processors.
  August 8, 2017   Andes Dual Issues New CPU Cores
Andes has delivered the N15 high-end CPU intellectual property based on the AndeStar V3 instruction set and expanded its lineup of RISC-V cores by introducing the 32-bit N25.
  August 8, 2017   Cavium Scales Down Xpliant Switch
The second-generation XP60 and XP70 target 10GbE and 25GbE applications while expanding Cavium’s addressable markets to include enterprise and carrier-access networks.
  August 8, 2017   HiFi 3z Handles Advanced Audio
Cadence’s newest licensable DSP core is well suited to the latest audio codecs for cellular voice and home entertainment as well as for voice processing in smart speakers.
  August 8, 2017   Synopsys EV6x Serves Up Big MACs
The upgraded DesignWare EV6x family of embedded-vision processor cores adds new configurations that enable designers to include up to four neural-network accelerators.
  July 31, 2017   Spectrum-2 Debuts 200GbE
The second-generation Mellanox Ethernet switch offers advanced QoS capability and strongly supports the emerging IEEE 802.3bs 200GbE and 400GbE standards.
  July 25, 2017   Embedded Skylake Speeds Networking
Intel’s new embedded Xeon Scalable processors derive from the recently introduced Skylake-SP, but the new Lewisburg south bridge is an even bigger improvement to the platform.
  July 25, 2017   MediaTek Offers Cat-NB2 Modem
MediaTek is the first company to bring a Release 14 NB-IoT modem to market, reducing cost by integrating the RF filters, power-management unit, and flash memory.
  July 25, 2017   Skylake X Scales Extreme PCs
Targeting high-end gamers and content creators, AMD and Intel have launched desktop processors that blow away earlier generations by offering much higher performance at lower prices.
  July 18, 2017   Achronix Turns to Embedded FPGAs
Even as revenue from its high-performance Speedster FPGAs ramps, Achronix is focusing on its new Speedcore embedded-FPGA intellectual property and anticipates launching FPGA “chiplets” for 2.5D packages next year. 
  July 18, 2017   Skylake-SP Scales Server Systems
Intel’s newest server-processor design modifies the Skylake client with greater AVX-512 capabilities and a new cache architecture while greatly improving the memory and I/O bandwidth.
  July 18, 2017   Snapdragon 450 Moves to 14nm
Qualcomm’s first low-cost 14nm processor, the Snapdragon 450 offers 25% faster CPUs, twice the video speed, greater camera resolution, and other improvements over its predecessor.
  July 18, 2017   Xeon Scalable Reshapes Server Line
Skylake-SP and the Purley platform replace both Xeon E5 and Xeon E7 with new processors that offer more cores and better performance, but often with higher power and prices as well.
  July 11, 2017   After 400GbE, IEEE Studies PHYs
The IEEE could ratify the 802.3bs standard as early as September, but an 800GbE follow-on will await detailed studies on new PHYs, including those for distances beyond 10km.
  July 11, 2017   Dialog Charges Into Bluetooth 5 Fray
Dialog’s entry-level DA14586 adds Bluetooth 5, making it the lowest-cost MCU to implement that technology, improving its prospects for low-cost IoT applications.
  July 11, 2017   MT8516 Enables Google Assistant
Purpose-built for voice-enabled digital assistants, the MediaTek MT8516 integrates four Cortex-A35 CPUs along with 2.4GHz Bluetooth and Wi-Fi transceivers.
  July 4, 2017   Cavium NIC Supports iWARP, RoCE
Cavium has delivered the first performance tweak to the FastLinq family since it acquired QLogic. The new 25GbE NICs can serve in “universal RDMA” systems that run iWARP and RoCE concurrently.
  July 4, 2017   Cypress PSoC 6 Broadens MCU Lineup
Cypress is taking on the IoT market by offering a broad family of high-performance Cortex-M4F MCUs that include Bluetooth 5 connectivity and improved security.
  July 4, 2017   MIPS I6500-F Drives Functional Safety
Imagination has enhanced the licensable MIPS I6500 CPU core to include features for ISO 26262 and other functional-safety standards, aiding automotive designers.
  June 27, 2017   Cortus APS3V Plays the RISC-V Card
Cortus has unveiled its first CPU core to use the RISC-V instruction set. The APS3V is the smallest commercial RISC-V core available for deeply embedded applications.
  June 27, 2017   Epyc Relaunches AMD Into Servers
AMD's new Epyc processor boosts IPC by 52% compared with the company’s previous generation and provides more memory and I/O bandwidth than Intel Xeon E5 processors.
  June 27, 2017   Trident 3 Adopts Programmability
Broadcom’s future enterprise-switch portfolio will revolve around the new Trident 3 architecture, which brings both programmability and 25G Ethernet to the company’s mainstream switch family.
  June 20, 2017   Intel Bridges Gap to 2.5D Packaging
Intel’s Embedded Multi-Die Interconnect Bridge (EMIB) packaging is less expensive than silicon interposers. It appears in an FPGA and likely in future server processors as well.
  June 20, 2017   Marvell First With Octal 5GBase-T PHY
Marvell is sampling the industry’s first eight-port PHY for 5GBase-T, as well as an optimized single-port device. The new chips meet full 802.3bz and NBase-T specifications.
  June 20, 2017   Nordic Tackles Multiprotocol IoT
Nordic Semiconductor has beefed up its wireless-MCU lineup by delivering the NRF52840, which adds more SRAM and flash memory plus enhanced security features.
  June 20, 2017   Xavier Simplifies Self-Driving Cars
Nvidia has revealed details of its next-generation Xavier SoC, the first chip to integrate all the processor cores that a complete Level 4/5 autonomous-driving system needs.
  June 13, 2017   Aquantia Brings NBase-T to PCs
Aquantia is entering the Ethernet-adapter market with network interface cards, based on its Aqtion controller chip, that support the 802.3bz standard for 2.5GbE and 5GbE.
  June 13, 2017   Dual-Issue ARC Boosts Performance
The new Synopsys HS4x/4xD adds dual-issue capability to the architecture. The CPUs run the same software as previous HS models but deliver a 25% boost in CoreMarks per megahertz.
  June 13, 2017   Nvidia’s Volta Upgrades HPC, Training
The first product using the Volta architecture, the Tesla V100 upgrades the previous P100 with 50% more flop/s, 20% more memory bandwidth, and up to 12x better machine-learning performance.
  June 13, 2017   Think Silicon Shrinks the GPU
Think Silicon designed its Nema GPUs for IoT and embedded applications requiring graphical user interfaces. The licensable cores come in Pico, Tiny, and Small sizes.
  June 6, 2017   Cortex-A55 Improves Memory
A new “little” core that pairs with Cortex-A75, Cortex-A55 offers many upgrades from its predecessor, including more data-cache bandwidth and neural branch prediction.
  June 6, 2017   SiFive Begins Licensing Cores
SiFive has extended its business model to include core licensing, offering customers a validated, supported RISC-V CPU with a simpler approach to licensing.
  May 30, 2017   Cadence C5 Flexes for Neural Networks
Enlarging the Tensilica Vision DSP IP family, Cadence’s new C5 targets convolutional neural networks (CNNs) and can execute more than one trillion 8-bit MACs per second.
  May 30, 2017   Cortex-A75 Has DynamIQ Debut
ARM’s new high-end CPU uses a more powerful microarchitecture and a new cluster design called DynamIQ to boost performance in mobile and embedded processors.
  May 30, 2017   Mali-G72 Targets Virtual Reality
ARM’s new Mali-G72 GPU raises the graphics-performance bar for high-end mobile devices. Its new Cetus display processor (DPU) supports 90fps 4K displays for virtual-reality applications.

Most Recent | Archive: 2017   |   2016   |   2015


Please Note:

If you have subscribed but aren't receiving our newsletter, email spam filters may be preventing us from delivering to you. Please add linleygroup.com to your white list. For questions or problems, please contact us.

If you wish to unsubscribe to any of our newsletter, click here.

Our Newsletter is not affiliated with any outside vendors. We respect your privacy and do not disclose our mailing list to any third parties. For more information, please see our privacy policy. Our newsletter is provided free of charge.

Events

Linley Processor Conference 2017
Covers processors and IP cores used in embedded, communications, automotive, IoT, and server designs.
October 4 - 5, 2017
Hyatt Regency, Santa Clara, CA
Register Now!
More Events »

Newsletter

Linley Newsletter
Analysis of new developments in microprocessors and other semiconductor products
Subscribe to our Newsletter »