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This newsletter is published by The Linley Group, a leading provider of technology analysis and strategic consulting in semiconductors for a broad range of applications including networking, communications, mobile and wireless.

Most Recent | Archive: 2017   |   2016   |   2015

  June 20, 2017   Intel Bridges Gap to 2.5D Packaging
Intel’s Embedded Multi-Die Interconnect Bridge (EMIB) packaging is less expensive than silicon interposers. It appears in an FPGA and likely in future server processors as well.
  June 20, 2017   Marvell First With Octal 5GBase-T PHY
Marvell is sampling the industry’s first eight-port PHY for 5GBase-T, as well as an optimized single-port device. The new chips meet full 802.3bz and NBase-T specifications.
  June 20, 2017   Nordic Tackles Multiprotocol IoT
Nordic Semiconductor has beefed up its wireless-MCU lineup by delivering the NRF52840, which adds more SRAM and flash memory plus enhanced security features.
  June 20, 2017   Xavier Simplifies Self-Driving Cars
Nvidia has revealed details of its next-generation Xavier SoC, the first chip to integrate all the processor cores that a complete Level 4/5 autonomous-driving system needs.
  June 13, 2017   Aquantia Brings NBase-T to PCs
Aquantia is entering the Ethernet-adapter market with network interface cards, based on its Aqtion controller chip, that support the 802.3bz standard for 2.5GbE and 5GbE.
  June 13, 2017   Dual-Issue ARC Boosts Performance
The new Synopsys HS4x/4xD adds dual-issue capability to the architecture. The CPUs run the same software as previous HS models but deliver a 25% boost in CoreMarks per megahertz.
  June 13, 2017   Nvidia’s Volta Upgrades HPC, Training
The first product using the Volta architecture, the Tesla V100 upgrades the previous P100 with 50% more flop/s, 20% more memory bandwidth, and up to 12x better machine-learning performance.
  June 13, 2017   Think Silicon Shrinks the GPU
Think Silicon designed its Nema GPUs for IoT and embedded applications requiring graphical user interfaces. The licensable cores come in Pico, Tiny, and Small sizes.
  June 6, 2017   Cortex-A55 Improves Memory
A new “little” core that pairs with Cortex-A75, Cortex-A55 offers many upgrades from its predecessor, including more data-cache bandwidth and neural branch prediction.
  June 6, 2017   SiFive Begins Licensing Cores
SiFive has extended its business model to include core licensing, offering customers a validated, supported RISC-V CPU with a simpler approach to licensing.
  May 30, 2017   Cadence C5 Flexes for Neural Networks
Enlarging the Tensilica Vision DSP IP family, Cadence’s new C5 targets convolutional neural networks (CNNs) and can execute more than one trillion 8-bit MACs per second.
  May 30, 2017   Cortex-A75 Has DynamIQ Debut
ARM’s new high-end CPU uses a more powerful microarchitecture and a new cluster design called DynamIQ to boost performance in mobile and embedded processors.
  May 30, 2017   Mali-G72 Targets Virtual Reality
ARM’s new Mali-G72 GPU raises the graphics-performance bar for high-end mobile devices. Its new Cetus display processor (DPU) supports 90fps 4K displays for virtual-reality applications.
  May 23, 2017   AMS Hides Smartphone Sensors
AMS’s “no-aperture” proximity sensors can peer through a smartphone screen bezel without requiring a hole in the cover glass, helping phone makers create a smooth-looking front surface.
  May 23, 2017   Snapdragon 660 Upgrades to 14nm
Qualcomm’s new Snapdragon 660 and Snapdragon 630 processors bring high-end performance and features, including 600Mbps LTE, to phones that sell for $200 to $400.
  May 23, 2017   Valens Retools for Autos
Israeli company Valens, developer of the PAM-based HDBaseT technology for consumer networks, is changing its focus to automotive networks using single twisted-pair cables.
  May 16, 2017   Andes NX25 Takes a RISC-V
Andes has adopted RISC-V as the basis for its next-generation AndeStar V5 ISA. The company’s first 64-bit CPU, the NX26, will use the new ISA; RTL will ship next quarter.
  May 16, 2017   Broadcom Delivers 100GbE Adapters
The NetXtreme E-Series server NICs use the company’s new Stratus controller chip, which builds on the 25GbE family that sampled two years ago.
  May 16, 2017   EEMBC Benchmarks IoT Power
EEMBC’s new IoTMark-BLE benchmark suite effectively measures the energy efficiency of IoT clients that use Bluetooth Low Energy to communicate with networks, hubs, or gateways.
  May 16, 2017   Intel Reworks FinFETs for IoT
Intel’s 22FFL is the first FinFET-based process targeting IoT devices. It combines elements of the company’s 22nm and 14nm nodes to reduce idle power and cost.
  May 9, 2017   Broadcom Quartz Packs TSN Features
Broadcom is diving into the industrial and wireless worlds of Time-Sensitive Networking (TSN) with its latest StrataConnect Ethernet switch.
  May 9, 2017   Google TPU Boosts Machine Learning
Google released new details on the architecture of its deep-learning accelerator along with data showing that it offers at least 10x better performance than comparable CPUs and GPUs.
  May 2, 2017   AMD Bumps Clocks in Low-End GPUs
AMD kicked off its 2017 graphics-upgrade cycle by refreshing sub-$250 Radeon GPUs. The new RX500-series offers a mild performance boost, but it also includes a new low-cost model.
  May 2, 2017   Galaxy S8 Debuts Exynos 8895
The debut of the Galaxy S8 demonstrates the capabilities of the 10nm Exynos 8895, which integrates new connectivity functions and outperforms other flagship mobile processors.
  April 25, 2017   Arteris Ncore 2.0 Simplifies Safety
Arteris combines the Ncore coherent NoC with its Resilience tools to ease SoC development for automotive and other safety-oriented applications.
  April 25, 2017   Intel Sets Tiny 10nm Goal Posts
Intel disclosed its 10nm node, which is far denser than the foundries’ 10nm and will ship late this year, and also described 14nm variants that boost transistor performance by 12–25%.
  April 18, 2017   Data Center Dominates OFC
OFC’s growing attendance despite limited-volume transport and long-haul markets indicates the critical role pluggable and embedded optics will play in both short data-center links and data-center interconnects.
  April 18, 2017   Sequans Adds CPU to IoT Modem
The new Monarch SX processor combines an embedded controller with a low-cost LTE modem that handles Category M1 and Category NB1, cutting the cost of cellular IoT devices.
  April 11, 2017   Intel Debuts First 3D XPoint Products
3D XPoint reduces latency by 10x compared with NAND-based solutions. Intel’s P4800X SSD highlights the advantages and deficiencies of this new memory technology.
  April 11, 2017   Marvell Builds Port-Extender ASSP
Marvell’s new Prestera Pipe 98PX1012 revisits the early Ethernet era of passive bridge components by using the 802.1BR standard to extend the port configurations for top-of-rack switches.
  April 11, 2017   Qualcomm 205 Trims LTE Cost
The new processor brings LTE data rates to feature phones and low-cost smartphones that are popular in India and similar countries.
  April 4, 2017   Ceva Telegraphs 5G Intent With XC12
The XC12 licensable DSP delivers a 2–8x performance boost over the XC4500 for important 5G tasks such as channel estimation, making it attractive for new wireless base stations.
  April 4, 2017   Mobileye Is Intel’s Designated Driver
Intel’s $15 billion offer to acquire Mobileye will shake up the fast-growing market for advanced driver-assistance systems (ADASs) and autonomous vehicles.
  April 4, 2017   NXP Airs Software-Defined Radio
The new QorIQ LA1575 is an innovative embedded processor with a programmable baseband. It can support multiple protocols including next-generation Wi-Fi and 5G cellular.
  March 28, 2017   Imagination Unleashes Furian
Imagination’s first wholly new GPU architecture since 2012, Furian offers higher graphics performance, full cache coherence, and improved GPU-compute capability.
  March 28, 2017   Innovium Bets on High-Density 100GbE
Ethernet startup Innovium is challenging Broadcom’s data-center dominance by offering a 12.8Tbps switch based on 50Gbps PAM4 serdes for high-port-count 50GbE and 100GbE.
  March 28, 2017   X-Gene 3 Up and Running
The X-Gene 3 server processor is now sampling. It already outperforms all other ARM-compatible processors and is on track to meet its frequency, feature, and schedule commitments.

Most Recent | Archive: 2017   |   2016   |   2015

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