Linley on CE
Independent Analysis of Semiconductors for Consumer Electronics


Volume 2, Issue 7  
August 1, 2007

Editor: Linley Gwennap
Contributors: Bob Wheeler, Jag Bolaria, Joseph Byrne

In This Issue


Our new report A Guide to Wireless Handset Processors, Second Edition is now available. Learn about the newest products and technologies for baseband and application processors. Order your copy today!

Ikanos Adds GPON

VDSL specialist Ikanos announced that it has licensed Terawave's GPON transceiver, with the intent of combining it with Ikanos's recently introduced Vx170 gateway processor. Offering both GPON and VDSL gateways provides value to network operators by helping them to standardize on a single processor architecture for both networks. Even nominal FTTH PON deployments often use DSL for the last leg, particularly in multi-dwelling units (MDU) where operators use VDSL to fan out a single PON connection to individual dwellings. Through the licensing arrangement, Ikanos gains an even footing with competitors, such as Conexant and PMC-Sierra, that already offer both VDSL and GPON options alongside their processors.

Conexant and PMC, however, both offer EPON options as well. EPON is the predominant flavor of PON in Japan and Korea. These two countries have driven sales of Ikanos's VDSL chips, making the absence of an EPON option from Ikanos conspicuous. There is reasonable logic behind Ikanos addressing GPON instead. EPON is less standardized than GPON, and existing suppliers are entrenched. Therefore, getting a new, homegrown EPON transceiver adopted is difficult and finding an accepted design to license improbable. Furthermore, France Telecom (Orange) has committed to GPON. Ikanos's key customer for Fusiv, France Telecom is a likely candidate for an Ikanos-based GPON gateway (ONT).

Ikanos is not Terawave's only dance partner. Terawave and Mindspeed announced in February that they were teaming up to deliver a single-chip ONT. Ikanos, however, is still evaluating whether to produce a single chip or a multiple-chip set.

Ikanos has complemented its gateway offering by partnering with Atheros on a reference design for a VDSL gateway incorporating 802.11n wireless LAN. Jointly marketed by the two companies, the design runs the 802.11n MAC on Fusiv's packet engines to reduce the burden on the host CPU. As with the Terawave deal, this partnership rounds out Ikanos's gateway offering and improves its competitiveness. —Joe

Additional coverage of Ikanos products for SOHO gateways appears in our report A Guide to SOHO Gateway Processors.


EMP Adopts OMAP

Ericsson Mobile Platforms (EMP) and Texas Instruments (TI) announced plans to develop "solutions" that combine TI's popular OMAP application processors with EMP's 3G baseband processors, which are used by Sony Ericsson, LG, Sharp, and others. The combination would be ideal for smartphones. The companies would not comment on whether these would be single-chip solutions.

We believe that EMP simply plans to incorporate OMAP chips into its smartphone platforms. Unlike most baseband vendors, EMP does not sell chips; rather, it licenses platform designs to its customers. Although EMP focuses mainly on 3G feature phones, which do not require an application processor, its previous smartphone platforms used the Marvell PXA processor. Thus, this announcement can be viewed as EMP simply exchanging the PXA processor for OMAP.

This move makes sense for EMP for two reasons. First, OMAP is the industry-leading application processor and is used in far more smartphones than is the PXA. Second, TI and EMP already have a long-standing partnership, as TI has been the primary foundry for EMP-designed ASICs.

This announcement does not appear to impact TI's roadmap for 3G baseband processors, which still consists entirely of custom ASICs plus a vague, unannounced product with integrated RF. Instead, this EMP-TI announcement should provide a small boost to the OMAP product line. —Linley

Complete coverage of OMAP and EMP processors appears in our report A Guide to Wireless Handset Processors.



New Report on Mobile Wi-Fi and Connectivity Chips

Wi-Fi (802.11) technology is moving from laptops to handsets as a way of rapidly transferring data and of accessing the Internet. New mobile Wi-Fi chips require a fraction of the power of standard Wi-Fi devices, enabling them to fit into cell phones, handheld game players, digital cameras, MP3 players, and similar applications. The biggest application area, however, will be in smartphones, which are already adopting Wi-Fi in record numbers. To further drive down cost, next-generation Wi-Fi chips will integrate Bluetooth and other connectivity functions. These connectivity chips, which are already sampling from some vendors, are changing the way handsets are designed.

A Guide to Wi-Fi/Bluetooth Connectivity Chips looks at the current generation of mobile Wi-Fi chips along with the next generation of combo connectivity chips. The report provides in-depth coverage of standalone Wi-Fi chips such as the Atheros AR6001, Conexant's CX53121, CSR's UniFi 2, NXP's BGM220, and ST's STLC4550, which is similar to the Conexant device. It also covers innovative products from two startups, Nanoradio and Redpine. Broadcom, Marvell, and Texas Instruments have included Bluetooth and, in some cases, FM radio in their newest Wi-Fi products, which are also featured in this report.

Rapid advances in handset connectivity have resulted in a plethora of standards and terminology. This report explains the different versions of Wi-Fi, with special emphasis on the new 802.11n standard, as well as important subprotocols such as 802.11e and 802.11i. The report also provides background on Bluetooth, FM radio, GPS, and NFC, and discusses the design of connectivity chips, including their radio subsystems, and future trends. After this tutorial section, the report provides an analysis of the market for connectivity chips, including Wi-Fi and Bluetooth market share and forecasts.

This report is written by Michael Stanford, a recognized expert in wireless and VoIP technology who brings his expertise to The Linley Group for the first time. Coauthor Linley Gwennap provides additional depth on the handset market. As the leading vendor of technology analysis for communications silicon, The Linley Group has the expertise to deliver a comprehensive look at the emerging connectivity market.

This report complements our Guide to Wireless Handset Processors by covering the connectivity side of the handset. Our unique technology analysis helps you zero in on the right connectivity chips for smartphones and other handheld devices. Whether you are looking for an innovative design solution, a vendor to partner with, or a rising company to invest in, this report will cut your research time and save you money. Accelerate your learning. Order A Guide to Wi-Fi/Bluetooth Connectivity Chips today.



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