Linley
on CE
Independent
Analysis
of
Semiconductors
for
Consumer
Electronics
Volume
2, Issue 7
August 1, 2007
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Editor:
Linley Gwennap
Contributors: Bob Wheeler, Jag Bolaria, Joseph Byrne
In
This Issue
Our
new report A
Guide to Wireless Handset Processors, Second Edition is now available. Learn about the newest
products and technologies for baseband and application processors.
Order your copy today!
Ikanos
Adds GPON VDSL specialist Ikanos announced that it has licensed Terawave's
GPON transceiver, with the intent of combining it with Ikanos's
recently introduced Vx170 gateway processor. Offering both GPON
and VDSL gateways provides value to network operators by helping
them to standardize on a single processor architecture for both
networks. Even nominal FTTH PON deployments often use DSL for
the last leg, particularly in multi-dwelling units (MDU)
where operators
use VDSL to fan out a single PON connection to individual dwellings.
Through the licensing arrangement, Ikanos gains an even footing
with competitors, such as Conexant and PMC-Sierra, that already
offer both VDSL and GPON options alongside their processors.
Conexant and PMC, however, both offer EPON options as well.
EPON is the predominant flavor of PON in Japan and Korea.
These two
countries have driven sales of Ikanos's VDSL chips, making
the absence of an EPON option from Ikanos conspicuous.
There is reasonable
logic behind Ikanos addressing GPON instead. EPON is less standardized
than GPON, and existing suppliers are entrenched. Therefore,
getting a new, homegrown EPON transceiver adopted is difficult
and finding
an accepted design to license improbable. Furthermore, France
Telecom (Orange) has committed to GPON. Ikanos's key customer
for Fusiv,
France Telecom is a likely candidate for an Ikanos-based GPON
gateway (ONT).
Ikanos is not Terawave's only dance partner. Terawave and Mindspeed
announced in February that they were teaming up to deliver
a single-chip ONT. Ikanos, however, is still evaluating whether
to produce a
single chip or a multiple-chip set.
Ikanos
has complemented its gateway offering by partnering with Atheros
on a reference design for a VDSL gateway incorporating
802.11n wireless LAN. Jointly marketed by the two companies,
the design runs the 802.11n MAC on Fusiv's packet engines
to reduce
the burden on the host CPU. As with the Terawave deal,
this partnership
rounds out Ikanos's gateway offering and improves its competitiveness.
—Joe Additional coverage of Ikanos products for SOHO
gateways appears in our report A
Guide to SOHO Gateway Processors.
EMP
Adopts OMAP
Ericsson Mobile Platforms (EMP) and Texas Instruments (TI) announced
plans to develop "solutions" that combine TI's popular
OMAP application processors with EMP's 3G baseband processors,
which are used by Sony Ericsson, LG, Sharp, and others. The combination
would be ideal for smartphones. The companies would not comment
on whether these would be single-chip solutions.
We believe that EMP simply plans to incorporate OMAP chips
into its smartphone platforms. Unlike most baseband vendors,
EMP does
not sell chips; rather, it licenses platform designs to its customers.
Although EMP focuses mainly on 3G feature phones, which do not
require an application processor, its previous smartphone platforms
used the Marvell PXA processor. Thus, this announcement can be
viewed as EMP simply exchanging the PXA processor for OMAP.
This move makes sense for EMP for two reasons. First, OMAP
is the industry-leading application processor and is used
in far
more
smartphones than is the PXA. Second, TI and EMP already have
a long-standing partnership, as TI has been the primary foundry
for
EMP-designed ASICs.
This announcement does not appear to impact TI's roadmap for
3G baseband processors, which still consists entirely of
custom ASICs
plus a vague, unannounced product with integrated RF. Instead,
this EMP-TI announcement should provide a small boost to
the OMAP product line. —Linley
Complete
coverage of OMAP and EMP processors appears in our report A
Guide to Wireless Handset Processors.
New
Report on Mobile Wi-Fi and Connectivity Chips
Wi-Fi (802.11) technology is moving from laptops
to handsets as a way of rapidly transferring
data and of accessing
the Internet. New mobile Wi-Fi chips require a fraction
of the power of standard Wi-Fi devices, enabling them
to fit into cell phones, handheld game players, digital
cameras, MP3 players, and similar applications. The
biggest application area, however, will be in
smartphones, which
are already adopting Wi-Fi in record numbers. To further
drive down cost, next-generation Wi-Fi chips will integrate
Bluetooth and other connectivity functions. These connectivity
chips, which are already sampling from some vendors,
are changing the way handsets are designed. A
Guide to Wi-Fi/Bluetooth Connectivity Chips looks
at the current generation of mobile Wi-Fi chips along
with the next generation of combo connectivity chips.
The report provides in-depth coverage of standalone
Wi-Fi chips such as the Atheros AR6001, Conexant's
CX53121,
CSR's UniFi 2, NXP's BGM220, and ST's STLC4550, which
is similar to the Conexant device. It also covers innovative
products from two startups, Nanoradio and Redpine.
Broadcom, Marvell, and Texas Instruments have included
Bluetooth
and, in some cases, FM radio in their newest Wi-Fi
products, which are also featured in this report.
Rapid advances in handset connectivity have resulted
in a plethora of standards and terminology. This
report explains the different versions of Wi-Fi,
with special
emphasis on the new 802.11n standard, as well as
important subprotocols such as 802.11e and 802.11i.
The report
also provides background on Bluetooth, FM radio,
GPS, and NFC, and discusses the design of connectivity
chips,
including their radio subsystems, and future trends.
After this tutorial section, the report provides
an analysis of the market for connectivity chips,
including
Wi-Fi
and Bluetooth market share and forecasts.
This report is written by Michael Stanford, a recognized
expert in wireless and VoIP technology who brings
his expertise to The Linley Group for the first
time. Coauthor
Linley Gwennap provides additional depth on the
handset market. As the leading vendor of technology
analysis
for communications silicon, The Linley Group has
the expertise to deliver a comprehensive look at
the emerging
connectivity market. This
report complements our Guide
to Wireless Handset Processors by covering the connectivity side of the handset. Our
unique technology analysis helps you
zero in on the right connectivity chips for smartphones
and other handheld devices. Whether you are looking
for an innovative design solution, a vendor to partner
with,
or a rising company to invest in, this report will
cut your research time and save you money. Accelerate
your
learning. Order A Guide to Wi-Fi/Bluetooth
Connectivity Chips today.
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