The
Linley Wire
Independent
Analysis of the Networking-Silicon Industry
Volume 5, Issue 19
October 12,
2005
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Editor: Linley
Gwennap
Contributors: Bob Wheeler, Jag
Bolaria, Joseph Byrne
In
This Issue
A
Guide to Next-Generation Wireless is now available
for immediate delivery. Are you up to speed on the plethora of new
wireless
standards
emerging
for the PAN, LAN, and MAN? For more information, visit our web site.
Check
out our new survey! We want your input on designs for next-generation
systems. Are you designing systems using ATCA and, if so, what
backplane are you using? Click here
to participate in our survey
and view the current results.
Wireless
USB Silicon On The Way
The past two weeks
have seen a flurry of announcements around Wireless USB (WUSB) and its underlying
WiMedia UWB PHY. At the Wireless USB Developers Conference in Tokyo, Realtek
demonstrated its first UWB product, the RTL8170 WiMedia PHY. Realtek's design
combines RF and baseband functions on a single 0.13-micron CMOS die, which
comes in a compact 7mm package. The RTL8170 implements a standard WiMedia
MAC-PHY interface for connection to Wireless USB or WiNet MAC devices. Realtek
becomes the second vendor, following Staccato, to demonstrate a single-chip
WiMedia PHY.
Meanwhile, Alereon is completing its Wireless USB solution with the addition
of MAC functions. The startup announced the AL4300 WUSB MAC/baseband chip
for 1Q06 sampling. When combined with the existing AL4100 WiMedia radio,
the AL4300 forms a two-chip solution for WUSB devices. The AL4300
includes SDIO,
Compact Flash (CF and CF+) and parallel-bus interfaces for integration into
a variety of consumer-electronics products. Customers that prefer a PHY-only
solution can use Alereon's AL4200 baseband chip, which is already sampling.
WUSB device (as opposed to host) MACs can implement a subset of the full
WiMedia MAC. This allows Alereon to complete the design of its WUSB
chip despite the
fact that the WiMedia MAC specification has not been released.
Synopsys is offering WUSB device controller (MAC) intellectual property
(IP) for integration into system-on-chip designs. The IP core implements
a WiMedia
MAC-PHY interface for connection to standalone PHY devices such as those
from Alereon, Realtek, Staccato, and Wisair. In addition to the MAC core,
the Synopsys
design requires firmware running on an separate CPU. The company's demonstration
uses an FPGA combined with an ARM9-based CPU. The Synopsys DesignWare
Wireless USB Device Controller IP is available now to early adopters.
These and other
forthcoming products set the stage for WUSB interoperability testing in
1H06. While Intel remains quiet about plans for WUSB in PC
platforms, the company is providing host-side WUSB development kits
and hosting an
interoperability lab. Given this increasing momentum, we expect WUSB
shipments to reach millions
of units in 2007. —Bob
Complete coverage of UWB and Wireless USB appears in our new report A
Guide to Next-Generation Wireless.
Greenfield
Advances Metro Ethernet Integration
Greenfield
Networks has begun sampling its Packetry II second-generation chip
set. The heart of the chip set is the G8000, a 36Mpps packet processor
and traffic manager. On the line side, the G8000 integrates 24 serdes
that operate at up to 3.125GHz. Using some or all of these serdes,
the chip supports 24xGbE SGMII/serdes ports or 3x10GbE XAUI ports.
Like Greenfield's first-generation chip set, Packetry II also supports
oversubscribed configurations using a separate multiplexer chip.
In these designs, the G135 12xGbE mux chip connects to the G8000
using 3.125GHz serdes links. On the fabric side, the G8000 integrates
another dozen 3.125GHz serdes for XAUI and proprietary interfaces.
With features not found in enterprise-class Ethernet switches, the
Packetry II chip set is clearly aimed at metro Ethernet designs.
In addition to L2 switching and IPv4/v6 forwarding, Packetry II
supports MPLS LER/LSR, L2 and L3 VPNs, and IPv4/v6 tunneling.
The chip set
also supports a large number of queues and a multi-level scheduler.
The G8000 buffers packets in external RLDRAM, while forwarding
tables are kept in external TCAM. Despite these advanced features,
a 24xGbE+2x10GbE
design requires only one G8000 device, a pair of G135 devices,
and memories.
With Packetry
II, Greenfield attempts to fill the hole between high-volume Ethernet switch
chips from companies like Broadcom and programmable
NPUs from EZchip, Sandburst, and Xelerated. But with metro protocols
still evolving, the question is whether or not OEMs will be comfortable
with a fixed-function design. Although fixed-function devices dominate
enterprise-switch designs, Packetry II could be ahead of the adoption
curve in metro-Ethernet switches. —Bob
Additional
coverage of Greenfield appears in our report A
Guide to Network Processors.
802.11n
Heads For November Showdown
On Monday, a new consortium was announced with the stated goal
of accelerating the development of the 802.11n draft standard.
The Enhanced Wireless Consortium (EWC) is a formal SIG made up
of many of the companies from the TGn Sync group plus Broadcom
and Conexant from the WWiSE camp. The EWC plans to make its specification
public in the next week. Previously, the competing TGn Sync and
WWiSE groups had agreed to work on a joint proposal for submission
at the 802.11n task group's (TGn) November meeting. Because the
joint proposal (JP) group was officially sanctioned by TGn, the
EWC will try to get the JP to adopt its specification.
Beyond these official groups, there appear to be three camps
divided by market segment: PC, consumer electronics (CE),
and cellular
handsets. The PC-centric companies are backing the EWC, the CE
companies appear split, and the handset-centric vendors are not
backing the EWC. Airgo Networks has not joined the EWC and is
instead aligning itself with the handset companies and
some of the CE vendors.
For any proposal to be adopted as the draft 802.11n standard,
it must receive 75% of the votes within TGn. It is not clear
if the
EWC can muster this level of support for the November meeting.
The holdouts may concede, leading to a complete draft in short
order. But the EWC's attempt to "fast-track" 802.11n
could instead backfire and simply lead to further delays. The worst-case
scenario for the IEEE is a repeat of the UWB deadlock in 802.15.3a,
which lead to an industry standard (WiMedia) outside of the IEEE
process. All of this leads us to wonder if the IEEE's standards
process has become obsolete in today's fast-moving environment.
—Bob Complete
coverage of 802.11n/MIMO appears in our new report A
Guide to Next-Generation Wireless.
Network Systems Design Conference
Updates
Mark
your calendars for October 18-20 when NSDC returns to San Jose.
Here are the latest program updates you won't want to miss.
Hot new startup Raza Microelectronics will present its XLR,
a high-speed multithreaded MIPS processor in Session 201.
Principal Architect
Dave Hass will describe the architecture of the device and how
it can be used to accelerate both networking and security applications.
Linley Gwennap opens the conference with the ever-popular Executive
Roundtable. CEOs and general managers from leading networking-silicon
vendors will discuss key issues facing the industry today.
Panelists include Syed Ali, CEO, Cavium; Johan Borje, CEO,
Xelerated; Daryn
Lau, VP and GM, Communications, AMCC; Martin Lund, VP and GM,
Enterprise Switching, Broadcom; and Jitesh Vadhia, SVP and
GM, Centillium.
Our CTO Roundtable, led by Bob Wheeler, wraps up the conference
with some lively debate and thought-provoking discussion.
We've gathered together the top technical people from
networking-silicon and software companies to discuss key
technology trends and
system-level design issues. Panelists include David Sonnier,
CTO, Agere Systems;
M. Raghib Hussain, VP of System Engineering, Cavium Networks;
Ofer Iny, CTO, Dune Networks; and Richard O'Connor, CTO,
Tundra
Semiconductor.
For the full program, visit the NSDC
web site.
New Report: A Guide to Access Processors
A
Guide to Access Processors has been extensively revised to bring
you the latest details on the products and vendors focused on
chips for the access infrastructure, which extends from the network
edge to customer-premises equipment. Network processors designed
for these applications typically operate at speeds of 2Gbps or
less. VoP (voice-over-packet) processors that support hundreds
of voice channels also serve these applications. As service providers
continue to upgrade their broadband infrastructure, more semiconductor
vendors than ever before are targeting this hot market.
This
150+ page report provides comprehensive coverage of access network
processors from Agere, AMCC, Broadcom, Conexant, Freescale,
Wintegra, and many more. Also covered are high-density packet-voice
processors from Texas Instruments, Centillium, Audiocodes, Freescale,
Mindspeed, and Octasic.
Like their higher-performance cousins, access network processors
are specialized devices for protocol processing. In access
equipment, these devices are optimized not so much for
raw throughput as
for flexible-and predictable-multiprotocol operation. They
are often
deployed in aggregation equipment such as DSLAMs.
High-density voice-over-packet (VoP) processors are the central
component of voice gateways used in cellular infrastructure
and VoIP networks. Several companies supply VoP processors
that can
handle hundreds of voice channels. These chips, which combine
packet processing and signal processing, convert between
packetized voice
and analog (POTS) voice in a voice gateway. Often, access
network processors are used in conjunction with an array
of VoP processors
to offload protocol processing and aggregation.
This handy guide, packed with valuable information, gives
you the analysis you need to help choose a supplier or
partner in this
field. We guide you through the maze of access and networking
technologies and also detail and compare the various processor
products that
support these technologies.
Order by November 15 to get a special prepublication discount.
For more information on this new edition, visit our web
site.
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here
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