The
Linley Wire
Independent
Analysis of the Networking-Silicon Industry
Volume 5, Issue 20
October 27,
2005
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Editor: Linley
Gwennap
Contributors: Bob Wheeler, Jag
Bolaria, Joseph Byrne
Special
Oversize NSDC Issue
In
This Issue
WILMA
SOCKS Linley SITE: Because our web/e-mail server is located in southern
Florida, we have been experiencing intermittent downtime
due to the effects
of Hurricane Wilma. If you have (or have had) any problems contacting us
by web or e-mail this week, we apologize and hope you will try again.
Wintegra
Reaches Second Generation
At last week's Network Systems Design Conference (NSDC), Wintegra disclosed
its second-generation WinPath architecture for access network processors.
The overall structure of WinPath2 is the same as that of WinPath1, but
all function units have been upgraded. Wintegra has doubled overall performance
by increasing the clock rate by about 50%, to 300MHz, and the number of
packet engines from four to six. The control CPU has been updated from
a
MIPS 5Kc
to a MIPS 24K at up to 450MHz. WinPath2 also adds new hardwired accelerators. A traffic-shaping accelerator
implements two levels of shaping without software support or five levels
with software. Because competing NPUs from Agere and AMCC already have
accelerated traffic management, this feature is an important addition
for Wintegra. A new cryptography engine accelerates DES, AES, and Kasumi ciphers
and MD5, SHA-1, AES and Kasumi hashes. A packet-inspection engine
accelerates
unanchored
searches within packets for applications such as intrusion detection
and content switching. With limited immediate applicability, these
features
anticipate
future requirements of access systems to provide, for example, encrypted
voice transmission.
When
the first WinPath2 products sample in 2Q06, their greater performance
will be well received. Data rates of access systems
are increasing,
and Wintegra's strongest competitors have entered the market at the
high end.
Leveraging
the success and code base of WinPath1, Wintegra should see strong
demand for its second-generation design. —Joe
Complete
coverage of WinPath2 appears in our forthcoming report A
Guide to Access Processors.
Cavium
Extends Nitrox Line
Also
at NSDC, Cavium announced the CN2800 security processor, which adds
new capabilities to its Nitrox 2 family, including
support
for AES-GCM,
AES-f8,
and SHA-2. AES-GCM can be computed more efficiently than the
current AES algorithms, resulting in improved throughput. AES-GCM
is being
driven by next-generation
IPSec ESP requirements. AES-f8 is required for Secure RTP. SHA-2
is needed
to replace SHA-1, a widely used hashing algorithm that earlier
this year was discovered to have some weaknesses. SHA-2 is expected
to
be in wide
use by
2007. The CN2800 is otherwise similar to the existing Nitrox 2 devices,
delivering up to 8.3Gbps of IPSec throughput (with minimum
packets) or 40,000 SSL
transactions per second. Large-packet throughput ranges to
20Gbps. The chips support
both inline and coprocessor designs with PCI-X, SPI-4.2, and
multiple RGMII interfaces.
The CN2800 is due to sample in 1Q06. Cavium will offer different
versions to provide different price/performance points.
The
Nitrox architecture uses programmable security engines, making
it easy for Cavium to support new algorithms simply by changing
the firmware.
This
architecture also allows the processor to shift engines from
one protocol to another as needed to meet performance demand.
This
also means that
Nitrox cannot achieve its peak performance on both IPSec and
SSL at the same time,
but few users need that level of performance. The CN2800 is
a useful addition to Cavium's already-strong Nitrox family.
—Linley Additional
coverage of Cavium's Nitrox family appears in our report
A
Guide to Security and Content Processors.
Stargen
First to Bridge ASI, PCI Express
Also at NSDC, Stargen introduced its Kestrel chip, which bridges
between PCI Express (PCIe) and ASI. This chip complements
the Merlin switch
chip that
the company introduced earlier this year. With a data throughput
of 16Gbps, Kestrel can be used in blade servers, networking
systems, and other systems
that use PCIe as the base interconnect. Together, Kestrel
and Merlin create Stargen's AXSys switching platform, which
is suitable
for
connecting
multiple
processors and multiple PCIe adapters. To support interprocessor
communication, Stargen has added message-passing semantics. Kestrel integrates 8 PCI Express lanes, which can be configured
as a single port or two x4 ports. The single port provides
high bandwidth,
whereas
the two-port option is useful for redundancy. Kestrel can
move data using DMA
or programmed I/O. The chip supports quality of service with
five virtual
channels, which can be serviced using weighted round robin
or strict priority. The chip uses credit-based and status-based
flow
control
to manage head-of-line
blocking and congestion in the fabric.
Kestrel dissipates 3.2W and is priced at $43. Stargen plans
to sample Kestrel to customers in November. To help OEMs
reduce development
time, Stargen
is also offering a Kestrel product development kit, which
includes a x8 PCIe
adapter and device drivers.
Stargen
is the first and only company to commercially offer a complete
ASI fabric. Assuming Kestrel has no critical
technical issues, the
company should
enjoy a six-month or greater lead over competing products.
With
a track record of shipping its Starfabric into similar
applications, Stargen
is in a good
position to transition from early samples to production.
Stargen's bigger challenge will be to build OEM support
for ASI while
it remains a technology
leader. —Jag
Additional
coverage of Stargen appears in our report A
Guide to High-Speed Interconnects.
Ample
Discloses Intelligent 2x10GbE MAC
Also at NSDC, Ample Communications disclosed technical details of
its Redhawk 2x10GbE MAC device. As might be expected, the device can
connect
a pair
of XAUI ports to a pair of SPI-4.2 ports in a basic 2x10GbE configuration.
In
addition to XAUI, Redhawk includes 10Gbps XFI line-side serdes for
direct connection to XFP modules. But with nearly 10 million gates,
Redhawk
is far more than a simple MAC device; like Ample's Harrier 24xGbE
MAC chip,
Redhawk
supports intelligent oversubscription. In a single-device configuration, Redhawk supports 2:1 oversubscription
by combining traffic from the two 10GbE (XAUI/XFI) ports into a
single SPI-4.2 port. Alternatively, the SPI-4.2 port can be
overclocked to
625MHz to provide
a full 20Gbps of throughput. In multidevice configurations, Redhawk's
second SPI-4.2 port can daisy-chain to another Redhawk device for
up to 4:1 oversubscription.
For designs with a mix of 10GbE and GbE ports, a Harrier device
can be connected to Redhawk's second SPI-4.2 port. Using these
multichip
configurations,
a
single 10Gbps network processor or ASIC can aggregate 4x10GbE ports
or 24xGbE+2x10GbE
ports.
To handle oversubscription, Redhawk supports sophisticated classification,
policing, and shaping and up to eight priority queues per port.
The chip's classification engine can use virtually any Layer 2-4
field
within the
limitations of on-chip table memory. Redhawk can even pass classification
results and
other information to the SPI-4.2 interface, thereby acting as
a packet preprocessor for the NPU or ASIC. To avoid dropping
low-priority
packets,
Redhawk supports
optional external DRAM. Unfortunately, the chip supports only
FCRAM, which has an uncertain long-term supply. Ample plans
to add support
for Micron
RLDRAM in the next version of Redhawk, due sometime in mid-2006.
The
A2122 Redhawk is priced at $350 in volume and is due to sample this
quarter. Although this device is not inexpensive, intelligent
oversubscription
can
help reduce overall system cost. As a result, we see Redhawk as
complementary to most 10Gbps network processors. —Bob
News
in Brief
This week, UWB-startup
Alereon announced its second round of funding. Led by Austin Ventures,
Centennial Ventures,
and Pharos Capital,
the $20 million
round brings total funding to $55 million. Alereon will
use the funding to move its initial WiMedia PHY chip set to
production and continue
development of its first Wireless USB solution. Alereon
is in a race with Staccato
and Wisair to be first to production with a WiMedia PHY. —Bob
Complete
coverage of Alereon appears in our new report A
Guide to Next-Generation Wireless.
Survey:
ATCA, Hot or Not?
The
rising drumbeat of the ATCA standard is everywhere. The first ASI
fabric, Stargen's AXsys, is now available, with others soon
to follow.
The transition
to a standard chassis design and standard backplanes seems inevitable.
But is it? We are bypassing the hype to ask you, our readers, how
ATCA is doing
in the real world. Let us know (click
here to vote) and
then check out the survey results to see how many people are working
on ATCA-based designs and what
backplanes they
are using. Thanks for your help!
New Report: A Guide to Next-Generation Broadband
Interface Chips
With broadband deployments attracting tens of millions of new subscribers
each year, demand for bandwidth is increasing dramatically. The
push for triple-play services is affecting both cable companies
and carriers
alike.
Cable TV companies,
who traditionally offered only video service, are now adding Internet
access and voice services. Traditional telephony carriers, who
offered voice and
data services, must now incorporate video in order to remain competitive.
Consequently, video-over-IP (Internet protocol) is set to fuel
significant changes in the access network. A Guide to
Next-Generation Broadband Interface Chips delivers
a complete analysis of the major vendors offering products for
this dynamic market. Vendors
for passive optical networks include Broadlight, Centillium, Conexant,
Freescale, Passave, and Teknovus. Also covered are leading VDSL2
vendors Broadcom, Centillium,
Conexant, Infineon, and Ikanos. We examine the VDSL silicon and
PON silicon markets, applications, and vendors as we look at silicon
for
both ends of
the wire: CO and CPE applications. As a result of the shift to triple-play, the industry has moved
quickly to establish new standards for enabling these services,
making it
difficult to
keep current on the emerging trends and technologies. "A Guide to Next-Generation
Broadband Interface Chips" provides the clear explanations you
need to understand this market. The report provides background on these technologies, with in-depth
coverage of the chip vendors in each segment, including product
details and roadmap
information where available. We compare the available solutions
and pick our winners for each segment. Only The Linley Group's
unique technology analysis
can provide this forward-looking view.
Order by November 30 to get a special prepublication discount.
For more information on this new edition, visit our web
site.
The Linley
Group's Latest Column:
EE Times Wireless Net DesignLine: How to choose the best
SoC for your WiMAX design
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