The
Linley Wire
Independent
Analysis of the Networking-Silicon Industry
Volume 6, Issue 3
February 15,
2006
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Editor: Linley
Gwennap
Contributors: Bob Wheeler, Jag
Bolaria, Joseph Byrne
In
This Issue
Intel
Spins IXP28xx Network Processors
Last
month, Intel formally launched new versions of its IXP28xx
network processor. In production since 4Q05, the new chips
offer a choice of cooler or faster operation. The IXP2805 replaces
the IXP2800 for new designs, while the IXP2855 is the new version
of the security-enabled IXP2850. Aside from differences in
core voltage at some clock speeds, the new chips are pin compatible
with their older counterparts.
Although the new chips remain in the same 130nm process,
Intel claims the IXP28x5 consumes 20% less power than
the IXP28x0 at
1.4GHz. The improved design also allowed Intel to add a new
1.5GHz speed grade, which dissipates 26W (typical) in
the 2805 flavor.
In conjunction with the IXP28x5 introduction, Intel discontinued
the original dual-IXP28x0 development platforms in favor of
its newer ATCA-based single-NPU designs. This change
leaves Intel
without a 10Gbps-capable development platform.
The
IXP28x5 chips are a step in the right direction, as they help
address the thermal-design challenges associated with
the IXP28xx. Because they are drop-in replacements for the
IXP28x0
NPUs, however, they do not address other shortcomings, such
as the chips' packet-interface limitations. Thus, the IXP28x5
makes
life easier for existing customers but does little to improve
Intel's competitiveness for new NPU-based designs. —Bob
Complete
coverage of Intel's IXP28x0 NPU appears in our recent report
A Guide to Network Processors.
Teknovus
Samples 3713 ONU
Teknovus recently announced availability of its TK3713 EPON
chip for optical networking units (ONU). This product bridges
between 802.3ah EPON and Ethernet in addition to performing
traffic management and classification. The TK3713 includes
an EPON MAC, two Ethernet service ports, and a line-rate 802.1D
bridge. For the EPON interface, this chip integrates the serdes
for Gigabit Ethernet. For the service ports, the TK3711 includes
one FE MAC and one GbE MAC. The TK3713 classifies packet traffic
using Layer 2, 3, and 4 fields. The 802.1D bridge switches
traffic among the service ports and EPON port.
The TK3713 complements the company's OLT chip and enhances
its earlier ONU chip. These enhancements allow Teknovus
to compete
with Passave for design wins at NTT, Japan's largest service
provider and the biggest customer of EPON in the near term.
Teknovus was the first vendor to offer multiple LLIDs
(logical link ID)
per ONU, enabling IPTV (as evidenced by KDDI in Japan). This
new ONU chip increases the number of LLIDs from 3 to 8. The
TK3713 is also in an easier-to-work-with PQFP package,
instead of the
BGA used by the company's earlier chip and by competing products.
The new chip integrates FEC and bidirectional encryption, while
many competing solutions as well as Teknovus's earlier products
provide downstream encryption only.
Compared
to Passave's ONU chip as well as Teknovus's earlier chip, the
TK3713 integrates memory to reduce external components
and cost of the system. This integration results in a smaller
footprint for the ONU as well as lower power dissipation.
Teknovus estimates that the TK3713 enables OEMs to sell
ONUs for about
$60, and the chip helps reduce power dissipation from 6W
in current ONUs to 2.2W. These improvements are helping
Teknovus
win designs
in Asia and should get the company noticed by vendors, such
as Mitsubishi, who are supplying ONUs to NTT. —Jag
Additional
coverage of Teknovus products appears in our recent report
A Guide to Next-Generation Broadband Interface Chips.
Freescale Joins Power.org
Erstwhile
PowerPC collaborators IBM and Freescale have hooked up again.
Freescale has joined Power.org, the consortium dedicated to developing
the Power/PowerPC community. As the company that supplies most
PowerPC processors, Freescale is an important addition to the
organization. Our further analysis of this announcement is available
in a white paper at: http://www.power.org/news/articles/freescale/PowerBackgrounder_tlg.pdf
In
other Power-related news this past week, IBM provided hints
about its Power6 server processor, and Freescale and STMicroelectronics
announced a joint venture. At ISSCC, IBM described elements of
Power6 operating at about 5GHz. An earlier Power server processor,
Power4, led to the PowerPC 970, one of the fastest processors
available
to
embedded system designers.
The
Freescale-ST venture will create PowerPC microcontrollers for
automotive applications and brings another major semiconductor
company into the Power Architecture community. The pairing would
be more exciting if the two companies were to collaborate on
next-generation IP-based consumer electronics. The combination
of ST's expertise in consumer electronics and Freescale's expertise
in communications could lead to interesting products. —Joe
Additional
coverage of Freescale's PowerPC processors appears in our
report A
Guide to Communications Processors.
News In Brief
Texas
Instruments recently announced a new
high-density voice-over-packet (VoP) processor. As with TI's
earlier VoP processors, the new
chip is bundled with software to create a complete solution.
Unlike the earlier designs that used C55x DSPs, the new design
is based on TI's C64x+ core. Design details and a product name
have yet to be released; based on TI's claim of "3GHz of
performance," we believe the chip to be a four- or six-core
design. The C64x-based chip supports 200 adaptive multirate channels,
about three times that of TI's previous top-end VoP processor,
the C55x-based TNET3010V. This performance level puts TI ahead
of key competitor Mindspeed, but we expect Mindspeed to counter
with a new chip in 1H06. —Joe
Additional
coverage of TI's VoP processors appears in our report A
Guide to Access Processors.
Last week,
MIPS Technologies disclosed a new CPU
core that is the first to implement
the company's multithreading extensions. The 34K CPU core
can implement up to five threads, but the actual number
is configurable
at design time. Each thread adds only 5% to 10% of the
core die area, resulting in a modest cost impact, but the performance
gain can be quite significant, especially for applications
that
are memory-bound. For example, simulations show a 60% performance
improvement on EEMBC benchmarks using only two threads.
Multithreading
is used in many proprietary network processors today; this
new announcement makes it possible for chip vendors to
add multithreading
to their products without designing their own CPU. —Linley
The
Linley Group Announces Program for Hi-End Switch/Router Seminar
Join
us on March 29 for a one-day seminar on Hi-End Switch/Router
Design. Featured speakers include Subash Roy, CTO, Transport
Products, AMCC; Patrick Bisson, Senior Director of Technology,
EZchip; Rich Schnur, Senior Product Manager, Freescale; Nick
Possley, Senior Staff System Architect, Xilinx; and Axel Kloth,
Senior Product Marketing Manager, Hifn.
Bob Wheeler, senior analyst at The Linley Group, will begin
the program with an overview of switch/router design
trends. The
second session will focus on Control-Plane CPUs, how they can
be used in control-plane applications, and what advantages
each CPU provides to the system designer. The third session
will cover
data-plane technology, examining the building blocks and component
technologies for advanced data-plane designs. The final session
will focus on metro packet processing, covering leading NPUs
and their application in metro networks.
This Linley Tech seminar will be held at the Doubletree Hotel
in San Jose. This seminar is free to qualified individuals
who register by March 24. The seminar is targeted at system
designers,
service providers, carriers, equipment vendors, OEMs, press,
and the financial community. Event sponsored by Freescale,
AMCC, EZchip, Xilinx, Hifn, and The Linley Group.
See our website for further details and registration information.
Linley Gwennap to Present in SafeNet Webinar
Principal analyst Linley Gwennap will give an overview of semiconductor
IP cores for networking chips as part of SafeNet's upcoming webinar
on Security in Silicon. This webinar will be available on March
15 at 1PM Eastern / 10AM Pacific time. For more information on
this webinar and how to attend it, access
http://www.safenet-inc.com/news/SecSiliconWebinar.asp
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