The
Linley Wire
Independent
Analysis of the Networking-Silicon Industry
Volume 6, Issue 9
May 18,
2006
|
 |
Editor: Linley
Gwennap
Contributors: Bob Wheeler, Jag
Bolaria, Joseph Byrne
In
This Issue
The new edition
of A Guide to Security and Content Processors will soon be available.
Are you up to date on the latest in IPSec
and SSL accelerators? Do you have the inside story on who's integrating
high-throughput encryption or developing content-processing solutions?
For more information, visit our web
site.
Stacking
Comes to GbE Switch Chips for SMB
At
Interop this month, Vitesse and Marvell rolled out new stackable
Gigabit Ethernet (GbE) switch chips for the small-to-medium business
segment. Vitesse introduced the E-StaX-34, the company's first
stackable GbE switch chip. The E-StaX-34 is a 28-port switch
with 24 GbE ports and four multimode stacking ports, which operate
in either standard GbE mode or a proprietary VStaX mode. Operating
at 2.5Gbps each, a pair of ports combines to form a 5Gbps stack
connection. The integrated serdes support this 2.5Gbps link rate
over a low-cost cable based on the High-Definition Multimedia
Interface (HDMI) specification used in consumer video products.
The E-StaX-34 is a Layer 2 design intended for smart-switch applications.
Marvell's
new switch, the Prestera-DX249, is a 24xGbE design with a pair
of dedicated 5Gbps stacking ports. Like the Vitesse chip, for
each stacking port the DX249 uses a pair of integrated serdes
links that support HDMI-style cables. Unlike Vitesse, Marvell
already offered enterprise-class switch chips such as the DX270
with 12Gbps stacking ports; the DX249 delivers a comprehensive
Layer 2 feature set at lower cost.
Marvell and
Vitesse complete their switch designs with PHY chips and CPUs.
Marvell's 24xGbE design requires six Alaska quad-PHY chips plus
a LinkStreet ARM9 processor. Vitesse integrates an ARM9 CPU in
the E-StaX-34 and requires only three octal-PHY chips for a 24xGbE
design. Although neither vendor announced switch-chip pricing,
Vitesse has a clear integration advantage that should result
in lower system cost.
Both vendors
replace the expensive and bulky CX4/InfiniBand-style stacking
cables used in existing switch designs (with 10/12Gbps stacking
ports). The downside of HDMI-style cabling is that the connectors
lack a mechanical lock to prevent inadvertent disconnections.
In the SMB market, where cost is paramount, customers may be
able to live with this limitation. —Bob
Additional
coverage of Marvell and Vitesse GbE chips appears in our report
A Guide to Gigabit and 10G Ethernet Silicon.
Emulex
Acquires Aarohi Last month, Fibre Channel HBA leader Emulex announced it will acquire startup
Aarohi Communications for $39 million. Aarohi is shipping the AV150 storage processor,
which targets FC SANs, to McData and other customers. The startup is developing
a second-generation device, code-named Raptor, that targets IP SANs. The Aarohi
processors can be programmed to perform functions such as virtualization, replication,
and backup, adding intelligence to the SAN and offloading the storage server.
Aarohi's management team, including CEO Ameesh Divatia, expect to stay on, becoming
a separate division of Emulex.
Although
the acquisition price merely matches the amount of money invested
in the company, becoming part of Emulex
will strengthen the Aarohi team and products,
as the team can now leverage Emulex's sales channels and infrastructure.
While Emulex has been strong in FC HBAs and switching,
the storage giant has had difficulty
adapting to emerging SAN trends such as virtualization and IP storage. The
company's acquisition of failed iSCSI startup Trebia has
not produced a strong product.
The proven Aarohi technology, in contrast, will allow Emulex to address these
growing storage trends, before it falls behind its faster-moving competitors.
—Linley
Complete coverage of Aarohi and Emulex appears in our report
A Guide to Storage Networking Silicon.
Free
Seminar on High-Speed Interconnects
Join us on June 14 at the DoubleTree Hotel in San Jose for a
Linley Tech seminar on High-Speed Interconnects. The program
will kick off with a technology and market overview by Jag Bolaria,
senior analyst with The Linley Group. The morning session will
address board-level interconnects, while the afternoon session
will concentrate on system-level interconnects. The seminar wraps
up with a panel on interconnect trends. Afterward, join us for
a networking reception complete with exhibits.
We have an outstanding lineup of technical presenters, including:
- Francois
LeMaut, AMCC Fellow, Lead Architect, AMCC
- Greg Shippen, System Architect, Freescale
- Michael
Miller, CTO & VP of Systems Technology, IDT
- Todd Comins,
CTO & Founder, StarGen
- Tom
Wilson, Director of Product Management, Tundra
- Jack Regula, CTO, PLX Technology
- Ofer Iny, CTO, Dune Networks
- Henry Ngai, Technical Fellow, Pericom
The
seminar is free to qualified individuals who register early.
For complete details and registration information, visit
our web site.
Free admission courtesy of our sponsors: AMCC, Freescale,
StarGen, Tundra, PLX, IDT, Dune, Pericom, and The Linley
Group.
To
receive The Linley Wire via e-mail, click
here
About
The Linley Wire
© 2002-2006 The Linley Group
|