The
Linley Wire
Independent
Analysis of the Networking-Silicon Industry
Volume 6, Issue 13
August 9,
2006
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Editor: Linley
Gwennap
Contributors: Bob Wheeler, Jag
Bolaria, Joseph Byrne
In
This Issue
A
Guide to SOHO Gateway Processors is now available for immediate
delivery. Get the latest information on the products and vendors
powering the rapidly evolving residential and SOHO gateway market.
For more information, visit our web
site.
PowerQuicc
Targets Deep-Packet Apps
At its Freescale Technology Forum, the company disclosed the
architecture of its next-generation PowerQuicc III processor,
the MPC8572. This
chip will be the first PowerQuicc to include hardware for deep-packet
inspection, supporting advanced applications such as intrusion
prevention, virus scanning, load balancing, content switching,
and multiservice routing. Due to sample in 1H07, the 8572 combines
two e500 CPUs with encryption, reg-ex, and table-lookup hardware
as well as integrated system peripherals.
The 8572 will be Freescale’s first processor that includes
technology from Seaway, an Ottawa startup that it acquired last
year. Seaway had developed the reg-ex engine, used for pattern
matching, and other content-processing technology. Ironically,
the 8572 is also the first PowerQuicc to incorporate technology
from its C-Port acquisition; the table-lookup unit comes from the
network-processor family that Freescale shut down two years ago.
The 8572 will not be the first dual-CPU PowerQuicc, but it
is the first to combine two e500 CPUs. Because of the high
power
dissipation
of the current dual-core 8641D, which uses the e600 CPU,
we expect Freescale to focus on the power-efficient e500
CPU for
future
multicore processors, despite its slightly lower performance. The
combination of two 1.5GHz CPUs with content-processing hardware
should allow the 8572 to perform sophisticated applications
such
as unified threat management (UTM) at multigigabit speeds.
By pulling together technology from various sources, Freescale
can
build a
powerful upper-layer processor that will leverage PowerQuicc’s
popularity in many networking applications. —Linley
Complete
coverage of PowerQuicc processors will appear in our forthcoming
report A Guide to High-Speed Embedded Processors.
AMCC
Acquires Quake
Last week
AMCC announced an agreement to acquire Quake Technologies for $69
million. Quake (Ottawa, Canada)
is a startup developing
10Gbps PHY components for optical modules and line
cards. The startup had raised about the same amount
of funding
as its
acquisition price. AMCC plans to keep most of Quake’s 50 employees that
are located either in Ottawa or in California. In September, AMCC
will integrate Quake’s revenue, which should
be at a run rate of about $5 million per quarter.
With more than 400,000 ports
shipped, Quake is the leading supplier of 10Gbps
PHY components.
After setting a strategic direction to expand AMCC’s
product lines from telecom into enterprise networking,
CEO Kambiz Hooshmand
is beginning to build an Ethernet product line. Acquiring
Quake will immediately establish AMCC as an early
leader in 10Gbps Ethernet
PHYs. Consequently, AMCC should gain a presence in
Ethernet systems at Cisco, Foundry, Extreme, Enterasys
and other leading OEMs.
Quake along with other industry players are developing
the SFP+ specification, which places the 10Gbps
PHY on the line
card and
significantly reduces the cost of an optical
module compared with the current Xenpak and
X2 modules. In
parallel,
Quake has developed
10GBase-LRM technology, which will help lower
the cost of 10GbE backbones. The IEEE should
approve the 10GBase-LRM
standard
later this year.
With limited resources and increasing competition
from other startups like Aeluros, Quake needed
more funds
to expand
its product line.
Though fast growing, the 10Gbps Ethernet
PHY market remains small in 2006. As a result,
Quake had not reached
profitability
and
would have been challenged to raise additional
financing. The acquisition
by AMCC provides Quake with the resources
to develop a competitive roadmap and provides
an exit for investors.
As part of AMCC,
the combined company should be able to expand
its revenue and build
next-generation products.
With
this acquisition, AMCC takes a big step in moving from its traditional
markets
into the rapidly growing
10Gbps Ethernet
market. In order to build a sustainable
Ethernet business, however,
AMCC
will need to expand beyond PHYs into other
10GbE building blocks. Over time, this
is likely to
put AMCC into
direct competition
with larger and entrenched Ethernet competitors
like Broadcom and Marvell.
—Jag
Complete
coverage of Quake appears in our report A
Guide to High-Speed Interconnects.
News In Brief
StarCore
LLC, the joint venture among Agere, Freescale, and
Infineon to develop DSP cores, is dissolving. The goals of
these three investors
for the company were to develop DSP cores and to make a business
of licensing the cores and selling tools and support. While
the company developed several processors, its failure to establish
a successful licensing business precipitated the dissolution.
Beyond
the investors, StarCore signed few licensees, including Legerity,
Skyworks, and Samsung. Even among the investors, only Freescale
has put several StarCore-DSP-based standard products into mass
production, basing both handset processors and high-end, multi-core
DSPs for voice, mobile infrastructure, and other applications
on StarCore DSPs. We expect Freescale to continue to develop
the StarCore
line and to coordinate with its erstwhile partners to mitigate
fragmentation of the architecture. —Joe
Linley Tech Seminar: Embedded Network Security Design Join us on September 21 for a Linley Tech seminar on designing
security into networking systems. The seminar is designed to
help system designers who are designing security systems or designing
security into routers or other equipment. The program features
technical presentations from leading suppliers of products for
this market including SafeNet, Cavium, Hifn, Sensory Networks,
Tarari, Freescale and AMCC.
Bob Wheeler, senior analyst at The Linley Group, will begin the
program with an overview of security technologies (e.g., VPN,
DoS, firewall, IDS/IPS, antivirus) and where they are being
deployed in the network. The remainder of the day will include
talks and
panel discussions covering a broad range of security-design
topics including Layer 2 security, VPN, firewall, and content-inspection
functions.
We've lined up top technical speakers for the event, including
Russ Dietz, CTO of Hifn; Steve Singer, System Engineering
Manager at SafeNet; Dave Lapp, System Architect at Freescale;
and Darren
Williams, CTO of Sensory Networks.
Regular
admission is $495, but is free to qualified individuals who register
by September 15. The seminar is targeted at system
designers, OEMs, network-equipment vendors, service providers,
security-software
vendors, press, and the financial community. This Linley
Tech seminar will be held at the DoubleTree Hotel in San
Jose. Space
is limited;
register today to reserve your place. See our web
site for further
information.
This event is sponsored by Freescale, AMCC, SafeNet, Cavium,
Hifn, Sensory, Tarari, and The Linley Group.
New Report: Guide to Gigabit and 10G Ethernet Chips
The
Ethernet market is marked by rapid technology transitions, which
often result in large shifts in vendor share. In Ethernet switches,
Gigabit Ethernet (GbE) shipments are still growing quickly, displacing
Fast Ethernet products. Despite strong competition from incumbent
vendors Broadcom and Marvell, new vendors such as Agere and Vitesse
are winning designs in this high-growth segment. In servers, the
transition to GbE is already complete and we are seeing the first
signs of 10G Ethernet (10GbE) adoption through adapter (NIC) shipments.
In both of these segments, large vendors have acquired startups
to fill holes in their solutions. With all of this new investment,
the market for enterprise networking silicon is becoming increasingly
competitive.
A Guide
to Gigabit and 10G Ethernet Chips breaks this market into five key
segments:
- GbE
switch chips
- 10GbE switch
chips
- GbE-over-Copper
physical-layer (PHY) components
- Single-chip
controllers (MAC/PHY) for adapter (NIC) and
LAN-on-motherboard (LOM) applications.
- 10GbE
NICs and controller chips
The report delivers
a complete chapter on six major vendors that offer products in
multiple segments: Agere, Broadcom, Intel,
Marvell, Realtek, and Vitesse.
Each major-vendor chapter includes company background information, full details
of announced products, a discussion of the vendor’s roadmap where available,
and our conclusions about the vendor and its products. Then, for each product
segment, we include a chapter covering other vendors and a chapter comparing
the products in the segment. These chapters include coverage of switch chips
from Fujitsu, Fulcrum, Greenfield Networks, and SwitchCore, as well as 10GbE
NIC and iSCSI HBA products from Chelsio, Myricom, NetEffect, Neterion, NetXen,
QLogic, Silverback, and others. Finally, we provide our outlook for the leading
vendors in each segment and for the overall market.
Unlike typical market
research, this report provides technology analysis and head-to-head
product comparisons. Which chips will
win designs and why? How
will these vendors be positioned as GbE and 10GbE continue to grow? Only The
Linley
Group’s unique technology analysis can provide this forward-looking view.
Order by September 8 to take advantage of a special prepublication
discount. For more information on this report, visit our web
site.
Did you
know that The Linley Group now publishes a newsletter focused
on semiconductors for consumer electronics? Here are headlines
from the latest edition of Linley
on CE:
- Freescale
Upgrades i.MX
- SH-Mobile
L3V Targets DTV (Renesas)
- News
In Brief (Texas Instruments, Ikanos)
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