The
Linley Wire
Independent
Analysis of the Networking-Silicon Industry
Volume 7, Issue 7
April 13,
2007
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Editor: Linley
Gwennap
Contributors: Bob Wheeler, Jag
Bolaria, Joseph Byrne
In
This Issue
Freescale
Announces First GPON Chip Leveraging a codevelopment deal with Alcatel, Freescale announced
its first standard GPON product, the MSC7120 controller. The
chip targets GPON gateways and other client-side applications.
The highly
integrated device includes an e300 Power CPU for the control
plane, a packet engine for the data path, and a Starcore
DSP for VoIP
processing. The MSC7120 conforms to the G.984 GEM protocol and,
per the GPON specifications, supports data rates of 2.5Gbps for
downstream traffic. Operating at 266MHz, the e300 CPU can support 8.5Gbps of I/O
throughput. The DSP operates at 178MHz and can process
four voice channels.
Freescale is the first GPON vendor to integrate VoIP processing.
For more voice channels, designers may attach Freescale's MSC7111
DSP over the local bus. For the client interface, the MSC7120
integrates two Gigabit Ethernet MACs, which may connect
to external PHYs using
RGMII. The chip also supports 802.1p for quality of support and
CRC for TCP/IP - offloading the local host.
Under the terms of its agreement with Alcatel, Freescale has
been supplying its GPON chip exclusively to Alcatel for several
months.
Now, the company is free to sample the device to other customers.
We expect this experience will enable Freescale to quickly
bring new customers to production. Along with the silicon,
Freescale
provides evaluation boards and software for real-time operating
system and application software for voice processing and signaling.
The codevelopment arrangement should ensure that products using
the MSC7120 will interoperate with Alcatel's GPON switches.
The partners will assist with interoperability testing. Making
the
chip broadly available will enable third parties to develop
compatible gateways, boosting Alcatel's position with carriers.
Freescale
has the ability to develop future GPON products without any
exclusivity to Alcatel, which could result in a broader range
of gateway
products.
With
early products compatible with Alcatel switches, Freescale is
positioned to become the GPON volume leader. Unlike
GPON leader BroadLight, Freescale does not provide an OLT
device,
which may
be a requirement for some OEMs. But the integrated VoIP
processing provides differentiation for gateway applications.
—Jag
Additional
coverage of GPON products appears in our report A
Guide to Broadband Interface Chips.
AMCC Updates PowerPC Lineup
As ESC last week, AMCC announced two new PowerPC processors:
the 460EX at the high end, and the 405EX at the low end. The
two new
chips are AMCC's first processors to move to 90nm CMOS, improving
clock speed and reducing power. Although the processors are general
enough to be used in a variety of applications, each has a specific
target, namely multifunction printers for the 460EX and enterprise
WLAN access points for the 405EX. Both are planned to begin sampling
in 3Q07.
Despite its name, the 460EX uses the PowerPC 440 CPU, just
like several other AMCC processors. By moving the 440 CPU
to 90nm,
the 460EX can operate at up to 1.2GHz, 50% faster than AMCC's
existing
130nm devices. The fast CPU is matched with a 256KB L2 cache
and 64KB of additional on-chip SRAM that can be software-mapped
for
special purposes, such as data buffers. The chip can connect
to external ASICs and other devices using PCI Express x4 and
x1. The
x1 port can also be configured as SATA, for systems with a
hard drive. For connectivity, the 460EX provides both dual
Gigabit
Ethernet and two USB 2.0 ports. AMCC's 405EP has been very successful in enterprise access points,
mainly for 802.11b/g. The 405EX uses a new 90nm version of the
PowerPC 405 CPU that operates at up to 667MHz, providing enough
performance for more demanding 802.11n and WiMax access points.
The highly integrated device provides all the key functions for
an access point, requiring only external memory, radio, and Ethernet
PHY chips. The radio connects via PCI Express for reduced pin count.
The 90nm process keeps power dissipation below 2W (typ) for the
processor. Pricing for the 405EX starts at $17.
Since
entering the PowerPC market, AMCC has sold millions of processors
into applications such as access points, printers, and set-top
boxes. The company has succeeded in these high-volume markets without
adopting technology, such as 90nm or multicore, that competitors
commonly use. Instead, AMCC focuses on delivering the right combination
of CPU performance and peripherals for each application. The new
90nm processors will help the company fend off competition in these
markets. —Linley
Additional
coverage of AMCC's PowerPC chips appears in our report A
Guide to High-Speed Embedded Processors.
Intel Adds Embedded Quad
Also at ESC, Intel
announced that it is bringing its quad-CPU product, code-named
Clovertown, to the embedded market. Following
its recent
pattern, Intel is introducing the embedded version about three
months after the server version. Although the server product is
available at speeds up to 2.66GHz and in a "low power" version
that dissipates 50W, the company chose to productize only the 2.0GHz
and 2.33GHz speed grades, which coincidentally are both rated at
80W (TDP).
Officially called the
E5335 and E5345 Xeon, the embedded versions differ from the server
versions mainly in Intel's commitment to
a five-year product lifecycle. The four-leaf Clovertown consists
of two die in one package, each die containing dual CPUs based
on Intel's 64-bit "Core" microarchitecture. Thus, for
software that can take advantage of all four CPUs, it delivers
up to twice the performance of earlier dual-CPU Xeon products.
The embedded Clovertown products include a total of 8MB of L2 cache
and a 1.33GHz front-side bus (FSB) interface. Like other Xeon chips,
they do not integrate any system logic or peripherals.
Although competitors offer embedded processors with 16 or more
CPUs, those products tend to use less powerful CPUs. Using 65nm
technology, the Core CPUs achieve about twice the clock speed of
the CPUs in Cavium's Octeon or RMI's XLR, for example, which both
use 90nm technology. Furthermore, the Core microarchitecture is
capable of executing more instructions per cycle (IPC) than these
competitors can.
For
applications that can tolerate 80W or that have a large base
of x86 software, Clovertown offers outstanding performance. But
for those who can consider MIPS chips, Octeon and XLR offer similar
performance and greater integration at less than half the power
of the Intel processor. —Linley
Additional coverage of Intel's embedded products
appears in our report A Guide to High-Speed Embedded Processors.
News In Brief
Confirming an earlier announcement by Chinese government officials,
Intel announced that it is building a 90nm wafer fab in China.
Trailing the 45nm fabs that Intel is now ramping by two generations,
the facility will initially manufacture system-logic chip sets
that complement Intel's PC processors. It also neatly answers the
question of how Intel will sustain the extended product lives of
its XScale-based NPUs and RAID processors, which both use the 90nm
technology that is being removed from Intel's leading-edge fabs.
Complete
coverage of Intel's RAID processors appears in our new report
A Guide to Storage Processors.
Last week,
PLX Technology announced two new PCI Express
switch products: the PEX8509 and the PEX8505. The former is an
eight-lane, eight-port
switch and the latter is a five-lane, five-port switch. These devices
have low latencies—about 118ns—and boast the industry's
lowest power dissipation. With one lane per port, the devices are
suited
for I/O expansion. Applications for the PEX8509 include notebook-docking
stations and networking control plane. The PEX8505 is a good fit
for single-board I/O expansion, which is often required in printers.
Each device is scheduled to sample later this quarter. The combined
switch products from PLX and IDT now meet the requirements of most
switching applications that use PCIe. —Jag
Additional
coverage of PCI Express switch chips appears in our report
A Guide to High-Speed Interconnects.
Linley
Tech Announces Program for High-Speed Interconnect Seminar
Join us on May 9 for a Linley Tech seminar on High-Speed Interconnects.
Jag Bolaria, senior analyst with The Linley Group, will kick off
the program with an overview of interconnect technologies, standards,
and silicon trends.
The morning session will feature talks focused on system interconnects,
while the afternoon session will concentrate on 10Gbps Ethernet
and beyond. The seminar wraps up with a lively closing panel on
choosing the right interconnect. Following the seminar will be
a networking reception complete with exhibits.
You won't want to miss this outstanding lineup of technical presenters,
including:
- George
A. Zimmerman, CTO, Solarflare Communications
"Delivering 10GBase-T Silicon"
- Alex
Dickinson,
President and CEO, Luxtera
"Silicon Photonics - The Next Wave in Low-Cost, High-Performance
Optical Interconnect"
- Sanjay
Kasturia, CTO, Teranetics
"10GBase-T: A Technology for Upgrading LANs"
- Jeff
Dodson,
Principal Director of Engineering, PLX Technology
"Measuring Performance for PCIe Systems"
- Brad
Booth,
Senior Principal Engineer, AMCC
"10Gbps Ethernet for the Enterprise"
- Bernhard
Friebe, Sr. Product Marketing Engineer, Altera
"High-Speed FPGA Interconnect Solutions"
- Kimkinyona
Fox, Product Marketing Manager, Rambus
"Integration Considerations for High-Performance I/O"
- Devashish
Paul, Product Marketing Manager, Tundra
"Developing Wireless Infrastructure using ATCA and
RapidIO"
- Ken
Curt,
Product Manager, Pericom
"Extending Reach for PCIe and Modern Interconnects"
- Peter
Yan, System Engineer, Freescale
"High-speed Interconnect Support for Quadruple-play
Convergence"
Visit our web site to view the complete program,
seminar details, and registration information. The seminar is free
to qualified
individuals who register early.
This event is sponsored by Freescale, AMCC, Altera,
Rambus, Pericom, Teranetics, Solarflare, and Tundra. Click
here for seminar information.
Networking Silicon Market Share 2006
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