The
Linley Wire
Independent
Analysis of the Networking-Silicon Industry
Volume 7, Issue 9
May 17,
2007
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Editor: Linley
Gwennap
Contributors: Bob Wheeler, Jag
Bolaria, Joseph Byrne
In
This Issue
New
Linley Tech Seminar on Enterprise & Data
Center Networking
Save
the date! Mark your calendars for July 18 for a Linley Tech seminar
on the technologies driving the future of enterprise and
data-center networks. This event will cover the newest chips
and technologies for switching and server connectivity. Details
on
this event will be announced soon. Sponsored by Freescale, AMCC,
Solarflare,
Luxtera, Mellanox, Dune, Cavium, Fujitsu, and The Linley Group.
If you missed
last week's seminar on High-Speed Interconnects,
you can now download the proceedings from the
event, which include
slides from all speakers. We have added transcripts of each of
the panel discussions, so you can see what the experts had to
say during these Q&A sessions. For a free copy of this
material, access our web
site.
Teranetics
Announces 10GBase-T PHY
Last week, Teranetics announced the industry's first single-chip
PHY for 10G Ethernet over copper (10GBase-T). The TN1010 chip
conforms to the IEEE 802.3an specification, which requires
a reach of 100m
using Cat6A/Cat7 wiring and up to 55m using Cat 6 wiring. Sampling
since November 2006, the device uses a 25mm package and is fabricated
in 130nm CMOS. The TN1010 is unique in supporting autonegotiation
between 10Gbps and 1Gbps. The device uses a single XAUI lane
to support 1Gbps. The first applications for the TN1010 include dual-port NICs,
switches, and storage systems. Chelsio and Tehuti have
already announced
products using the Teranetics chip, and we expect several other
major vendors of switches and NICs to follow in the next few
months. Although the power dissipation of the TN1010 is
around 10W, Teranetics
has demonstrated the PHY in Xenpak and X2 modules plugged into
existing switches and dual-port NICs. Although X2 modules require
lower power than 10W, the voltage and current specifications
of these modules facilitate use of the TN1010. Teranetics
has demonstrated
the PHY in multi-port 10GbE line cards and 10GbE pizza-box switches.
Remarkably,
the 60-employee startup has beaten out major vendors like Broadcom
and Marvell to developing a single-chip 10GBase-T
PHY. The company, however, does have competition from Solarflare,
which was the first vendor to announce and sample a 10GBase-T
solution. Solarflare additionally offers 10GbE controllers
for a complete
NIC solution. By developing a single chip, however, Teranetics
has landed the majority of the first wave of designs. By using
65nm process technology, Teranetics should be able to reduce
power dissipation – it has promised to sample a 5W device
by 2008. Although the first wave of 10GBase-T PHYs should ship
in significant
volumes, it will be the second generation of devices that ramps
up to millions of 10GBase-T ports. —Jag
Both
Teranetics and Solarflare presented at our recent High-Speed
Interconnect seminar; download their presentations here.
Broadcom
Crowds 10GbE Converged-NIC Field
This week, Broadcom announced its first NIC/LOM chip for 10G
Ethernet (10GbE). Like Broadcom's Gigabit Ethernet converged-NIC
(C-NIC)
chips, the new BCM57710 will support TCP Chimney, iSCSI, and
RDMA (or iWARP). As we expect from Broadcom, the 57710
is highly integrated,
packing dual 10GbE ports for redundancy, integrated CX4/KX4 PHYs,
and a PCI Express x8 interface. The chip also includes an undisclosed,
but probably large, amount of on-chip memory. This allows the
57710 to support a large number of active flows without
external memories
of any kind. To minimize both latency and buffer-memory requirements,
Broadcom employed a cut-through architecture. Broadcom expects
the chip, which is currently sampling, to reach production in
4Q07.
Meanwhile, startup NetEffect announced production availability
of its second-generation 10GbE NICs at the end of April. Although
the company announced only board-level products, the NE020
family is built around NetEffect's second-generation controller
chip.
With dual CX4-capable network ports and a PCIe x8 interface,
NetEffect's chip offers a similar level of integration to Broadcom's
57710.
The NetEffect design also uses cut-through operation for RDMA
traffic. Unlike Broadcom, however, NetEffect requires external
DRAM to buffer
other traffic. The NE020 currently supports TCP Chimney and
RDMA; iSCSI drivers are due in 2H07.
Other vendors, including Chelsio and NetXen, offer converged,
or "unified
wire", 10GbE NICs or controller chips that support TCP offload,
iSCSI, and RDMA. Although late to market, Broadcom is the leading
vendor of GbE controllers and has strong relationships with leading
server OEMs. For blade servers, Broadcom is unique in offering
complementary 10GbE switch chips for the backplane fabric. NetEffect
stands out with mature RDMA support, which is important for high-performance
computing applications. Due to the large amount of software required
to support multiple offloads across multiple operating systems,
it will be difficult even for Broadcom to offer a truly universal
10GbE product. —Bob
Complete
coverage of 10GbE controllers and NICs appears in our report
A Guide to Gigabit and 10G Ethernet Chips.
Conexant
Enters GPON Market
Last week, Conexant announced its Xenon-IIIG product family, which
consists of the CX95202 GPON controller and the CX95203 EPON controller.
The two devices integrate functions for the PON MAC and residential
gateway. Although Conexant plans to offer OLT devices, it currently
uses FPGAs for the OLT. To ensure interoperability, the company
has conducted interoperability tests with products from 15 vendors,
including Alcatel.
The two ONU devices use a common core but different interfaces
for the specific network. A shared-memory architecture ensures
wire-speed performance. The common core consists of an ARM processor
for control functions, packet processor for the data path, and
DSP for VoIP. The DSP can support 4 VoIP channels with three-way
calling. For the client interfaces, each device offers two MII
and three GMII ports for Ethernet and a PCI interface for other
home-connectivity technologies such as MoCA, HomePNA, and HomePlug.
Conexant's controllers are the first to offer comprehensive Layer
3 gateway functions, such as IP routing and NAT. They perform Layer
2 (802.1D) bridging with 64 VLAN tags and can classify data using
Layer 2 or Layer 3 tags. Each device uses 802.3 flow control and
provides QoS using up to eight queues based on 802.1p, ToS, or
DiffServ. Each queue can be mapped onto a LLID (logical link ID)
for EPON or onto a T-CONT (traffic container) for GPON. The EPON
product additionally supports China Telecom security extensions.
Although the PON market is relatively small, it has attracted a
large number of players. PMC-Sierra continues to be the market
leader with its EPON shipments. Teknovus and Cortina (formerly
Immenstar) ship smaller volumes. Conexant joins BroadLight and
Freescale in the GPON market. Because of entrenched vendors in
the existing EPON markets, Conexant must target developing regions
such as China. To win designs against this crowded field, Conexant
can promote a common software interface across GPON, EPON, and
its popular DSL products. —Jag
Additional
coverage of Conexant appears in our report A Guide
to Broadband Interface Chips.
News
in Brief
Last week,
Xelerated announced an impressive $23 million round of funding.
The round was led by a Swedish pension fund and included
existing venture investors Atlas Venture, Alta Partners, Accel
Partners and Amadeus Capital. Xelerated will use the new funding
to expand its sales and support capabilities as well as to complete
development of its X12 next-generation NPU. The new funding follows
announcements of design wins at Fujitsu, Huawei, and ZTE. —Bob
Report Highlights: Security Processors and Accelerators
A Guide
to Security Processors and Accelerators has been has been completely
restructured to provide in-depth coverage
of
processors that integrate high-speed security functions such as
encryption, compression, and content inspection.
This new breed of processors takes integration to the next level
by integrating one or more CPUs, memory and I/O controllers,
and special-purpose engines for security functions. These integrated
security processors are replacing the combination of a standard
processor plus accelerator for many new designs.
Here are some of the many highlights from this report:
- Coverage of Cavium's new Octeon Plus CN58xx multi-core MIPS
processors and Nitrox PX encryption accelerators
- Coverage
of Freescale's new MPC8572 dual-core processor with content-inspection
engines
- Coverage of Raza Microelectronics' (RMI) new
XLS single- and dual-core MIPS processors with high-speed
encryption
- New coverage of SafeNet's SafeXcel-5160 integrated
security processor
- Coverage of startup P.A. Semi's first product,
a dual-core Power processor with high-speed encryption
In addition, the report covers IPSec and SSL accelerators (coprocessors)
from Broadcom, Hifn, and SafeNet as well as content-inspection
accelerators from Tarari, NetLogic, and Sensory Networks. With
one report, you can quickly compare the key vendors and their
products and accelerate your selection process. Order
by May 31 to take advantage of the prepublication
price. For further details, visit our web
site.
Linley's
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