The
Linley Wire
Independent
Analysis of the Networking-Silicon Industry
Volume 7, Issue 17
October 10,
2007
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Editor: Linley
Gwennap
Contributors: Bob Wheeler, Jag
Bolaria, Joseph Byrne
In
This Issue
A Guide to
10G Ethernet Adapters and Controller Chips is now available. Get the latest information on 10G Ethernet
controller chips and NICs designed for server applications as well
as PCI Express switch chips. The report also covers TCP offload
and iSCSI chips designed for NIC/HBA applications. For more information
on this new report, visit our web site.
Cavium
Improves Low End with CN50xx This week, Cavium brought
the power of Octeon Plus to its low-cost line in the form of
the CN50xx, a family of single- and dual-core
MIPS processors that operate at speeds of up to 700MHz. The new
processors are pin- and software-compatible with Cavium’s
current CN30xx devices while offering significantly better performance.
(The CN30xx tops out at 500MHz.) The new devices also burn less
power, thanks to a shift from 130nm to 90nm manufacturing. Cavium
expects to sample the CN50xx by December. Despite
being a relative newcomer to the processor game, Cavium has
made significant advances. In the past year, the CN30xx has
gained design wins in broadband gateways, 802.11n routers, and
secure routers from NetGear, Cisco/Linksys, Omron, and others.
The processors are also found in small/medium business (SMB) applications
such as storage and security appliances and unified “office
in a box” solutions. The new CN50xx fits into all of these
categories, offering more performance headroom for SMB products
in particular.
By making
the new parts pin-compatible with the current ones, Cavium enables
customers
to leverage their existing board and software
designs, taking advantage of the infrastructure investment that
Cavium and its partners have made for the CN30xx. But this decision
kept the company from adding newer interfaces such as PCI Express
or serial ATA. These interfaces will probably appear in a next-generation
processor next year. In the meantime, the new CN50xx should continue
Cavium’s momentum in the SOHO and SMB segments. —Linley
Coverage
of Cavium’s MIPS processors appears in our report A
Guide to High-Speed Embedded Processors.
IDT
and Pericom Demo PCI Express Gen2
At last month’s Intel Developer Forum, several vendors announced or demonstrated
products supporting the second-generation (Gen2) version of PCI Express (PCIe).
IDT demonstrated the industry’s first Gen2 switch chip, and Pericom demonstrated
prototypes of its Gen2 redriver chip.
IDT’s demo coupled its PES16T4G2 switch chip with an Intel
Gen2 chip set and Gen2 endpoints from ATI and Broadcom. The 16T4G2
has one upstream x4 port and three downstream x4 ports, all capable
of operating at 5Gbps per lane. Like IDT’s PCIe v1.1 switch
chips, the 16T4G2 supports a large 2KB maximum payload size and
cut-through operation for latencies of 180ns or less. Priced at
$35 in volume, the 16T4G2 is currently sampling. For Gen2 designs
requiring only two downstream ports, IDT offers the 12-lane PES12T3G2.
Pericom demonstrated
prototypes of its Gen2 redriver chips, which are used to extend
the reach of PCIe signals. Unlike retimers,
redrivers improve signal integrity without extracting clocking
information. Redriver applications include driving PCIe backplanes
or external cabling. Pericom’s PCIe Gen2 redrivers are due
for production availability in 1Q08. The company also offers Gen2-compatible
analog switch chips, which can be used for failover and other multiplexing
applications. Although Pericom is shipping PCIe v1.1 packet switches,
it has not yet announced any Gen2 packet switches.
For dual-socket server
designs, the new IDT and Pericom chips mate with Intel’s
Seaburg MCH (north bridge). Seaburg integrates 32 PCIe lanes
that support 5Gbps operation for an aggregate 16GB/s
of bidirectional I/O bandwidth (after 8b/10b encoding overhead).
Complementary Gen2 chips like those from IDT and Pericom will help
OEMs make optimal use of this massive bandwidth. —Bob
Coverage
of PCIe switch chips for server applications appears in our
new report A
Guide to 10G Ethernet Adapters and Controller Chips.
Seminar Features High-Speed Processors
The Linley Tech seminar on November 14 will feature a packed
lineup of technical presentations addressing two key themes:
processors
for SOHO/SMB and high-speed embedded processors. The presentations
will address processor architecture and design and their applications
in networking and communications. Presentations will include:
- Linley
Gwennap, principal analyst of The Linley
Group, will open the day with an overview presentation
on the topic of embedded processor design and market and
technology trends.
- David
Sonnier, a chief architect at LSI,
will explain how company’s new APP2200 processor combines
control-plane and data-plane engines to deliver carrier-grade
performance for SMB equipment.
- David
Fotland, CTO of Ubicom, will describe
how the company’s unique processor architecture addresses
the increasing demands of the connected digital home.
- Toby
Foster, a system architect at Freescale,
will examine the optimization of CPU design, application
offloads, memory subsystems, and high-speed interfaces in
dual-CPU processors.
- Anant
Agarwal, CTO of Tilera, will
describe the company’s radical new 64-CPU architecture
and how it can accelerate intrusion prevention, spam filtering,
QoS provisioning, and other Layer 3-7 applications.
- Mark
Hayter, chief system architect at PA Semi,
will describe the company’s dual-CPU Power processor,
including example system block diagrams and a detailed device
power breakdown.
- Dan
Bouvier, director of solutions architecture at AMCC,
will discuss how the demands of all-IP convergence affect
the design of the CPU complex, accelerators, and I/O in
next-generation processors.
- Raj
Singh, a communications architect at IBM,
will discuss how trends such as virtualization and convergence
can be addressed by IBM’s system-on-a-chip technology.
Don't miss the opportunity to hear these distinguished
technical speakers discussing the newest processors
and design trends.
This Linley Tech seminar will be held in San Jose
at the DoubleTree Hotel. Mark your calendars and register
now at our web site.
Free
admission for qualified attendees is made possible
by our event sponsors: Freescale, AMCC, LSI, IBM, Ubicom,
PA Semi,
and Tilera.
Did you know
that The Linley Group also publishes a newsletter focused on
semiconductors for mobile communications and consumer electronics?
Get our analysis
of this market with the latest edition of Linley
on CE:
- ARM Details Cortex-A9
- Broadcom Delivers HD VideoCore
- MediaTek Acquires ADI's Basebands
- Report Highlights: Guide to Mobile TV Chips
To subscribe
to Linley on CE :click
here. To
receive Linley Wire via e-mail, click
here
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The Linley Wire
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