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For clients
desiring off-the-shelf assistance, we offer standard reports on
specific topics. These in-depth reports provide an overview of
a particular market segment, including market size, technology
trends, and expected developments. The reports then analyze all
announced products in that segment, comparing their key technical
features, performance, and architecture while highlighting their
strengths and weaknesses. Readers find our reports particularly
useful when they are selecting a vendor or partner. Each report
also contains tutorial material for those who are less familiar
with the technical terminology.
Report
Abstracts:
Quantitative
Data: |
Communications Silicon Market Share 2007 |
Published
Apr. 2008 |
This
report provides market share information for more than 15 categories of wired-communications and wireless chips. Additionally, it provides market-data for embedded microprocessors, FPGAs, and 10G adapter cards. Communications semiconductor
product categories covered in the report include network processors,
Gigabit Ethernet components,
DSL and PON transceivers, security processors, and Sonet ICs. The
report also includes market share for switch fabric and interconnect
chips and for high-end embedded microprocessors. |
Communications Silicon Market Forecast |
Published Dec. 2007 |
This
report provides market forecast information through 2011 for more than
fifteen categories of wired and wireless communications
semiconductors. Wired-communications semiconductor
product categories
covered
include network processors, 10 Gigabit Ethernet components,
broadband transceivers, security processors, and Sonet
ICs. Also included are forecasts for interconnect
chips, network search engines, and microprocessors used
in communications applications. Covered wireless components
include baseband processors, Bluetooth and Wi-Fi chips
for handheld applications, and mobile-TV receivers. |
| Wireless
and Consumer:
|
A
Guide to Mobile TV Chips, 1st Edition |
Published Sep. 2007
|
This
report covers the emerging mobile television market
including chips for MediaFLO, T-DMB, and DVB-H. Covered
vendors include DiBcom, Siano, Texas Instruments, Analog
Devices (Integrant), Telegent, Afa Technologies, and
many more.
|
| A
Guide to Wi-Fi/Bluetooth Connectivity Chips, 1st Edition |
Published
Jul. 2007 |
This
report covers standalone Wi-Fi chips and chips that combine
Wi-Fi
with other functions such as Bluetooth. Vendors include
Atheros, Broadcom, Conexant, CSR, Marvell, NXP, STMicroelectronics,
TI, and many more.
|
| A Guide to Wireless Handset Processors, 2nd Edition |
Published
Jun. 2007 |
This report examines the fast-moving handset market with
coverage of baseband and application processors and the vendors
that provide them. Vendors include TI, Qualcomm, NXP, Infineon,
LSI, Marvell, Freescale, and Broadcom. Also covered are processors
from Analog Devices, Ericsson, Renesas, STMicroelectronics,
and many more. This edition includes BDTI benchmark results.
|
| A
Guide to Communications Processors, 4th Edition |
Published
Nov. 2007 |
This
report covers processors that combine control-plane and
data-plane functions in a single highly integrated device,
such as Freescale's PowerQuicc products. Communications
processors typically include a CPU for high-level software
and a combination of programmable and hard-wired data-plane
engines. Target applications include high-end
SOHO and SMB gateways, SMB "office
in a box" designs, and access infrastructure
equipment.
|
Networking Silicon:
|
| A
Guide to High-Speed Interconnects, 4th Edition |
To be published
May 2008 |
| This
report examines the leading high-speed interconnect technologies, including PCI Express, RapidIO, and HDMI. Also covered are products for DisplayPort as well as bridge and switch products for PCI Express and RapidIO. Vendors covered include Analogix, IDT, Intel, Mercury, NEC, NXP, Paradise, Pericom, PLX, PMC-Sierra, Silicon Image, STMicroelectronics, TI, Tundra, and others. Also included are IP vendors ARM, Rambus, Synopsys, PLDA, Gennum, and more. FPGA vendors include Altera, Lattice, and XIlinx. |
| A Guide to Network Processors, 9th Edition |
Published
Jan. 2008 |
This
report focuses on NPUs spanning data rates from
2Gbps to 100Gbps. Vendors covered include AMCC, Broadcom,
Bay Microsystems, EZchip,
LSI, Netronome/Intel, Wintegra, and Xelerated. We also
cover alternative architectures that are
not software
programmable from Cswitch,
Ethernity, Lightstorm, and TranSwitch/Opulan.
|
| A Guide to Broadband Chips, 3rd Edition |
Published
Dec. 2007 |
This
report covers chips focused on VDSL2 and PON. Vendors covered
include Broadlight, Centillium, Ikanos, Infineon, PMC-Sierra,
Teknovus, Conexant, Cortina, Freescale,
and more. We examine the VDSL2 silicon and PON silicon
markets, applications,
and vendors as we look at silicon for both ends of the
wire: CO and CPE applications.
|
| A
Guide to 10G Ethernet Adapters & Controller Chips, 1st
Ed. |
Published
Sep. 2007 |
This
report combines our previous coverage of Gigabit and 10G
Ethernet controller chips and NICs designed for server
applications as well as PCI Express switch chips. It also
includes TCP offload and iSCSI chips designed for NIC/HBA
applications. Covered vendors include Broadcom,
Chelsio, Intel, Myricom, NetEffect, Neterion, NetXen, IDT,
NextIO, PLX, and more. |
A
Guide to Ethernet Switch and PHY Chips, 4th Edition |
Published
Aug. 2007
|
This
report covers 6 key segments: GbE
and 10GbE switch chips, 10GbE PHYs for copper and optical
media, GbE-over-Copper physical-layer (PHY) components, 10GbE
(KR) backplane transceivers, and Power over Ethernet controllers.
|
| A
Guide to Security Processors & Accelerators, 6th
Edition |
Published
May 2007 |
This
report covers processors that integrate high-throughput encryption,
VPN and SSL accelerators, and content-inspection
accelerators. Companies covered include Cavium, Freescale,
Intel, Mistletoe, PA Semi, Raza, SafeNet, Broadcom, Hifn,
NetLogic, Sensory Networks, and Tarari.
|
| A Guide to Storage Processors, 4th Edition |
Published
Mar. 2007 |
This report focuses on RAID processors, storage network processors,
SAS expanders, and iSCSI target HBAs. Vendors covered include
Emulex, Intel, LSI Logic, PMC-Sierra, QLogic, Vitesse, and
more. Also covered are emerging companies such as Aristos,
Astute, Chelsio, iStor, and iVivity.
|
| A
Guide to High-Speed Embedded Processors, 3rd Edition |
Published
Sep. 2006 |
This
report covers high-end embedded processors from AMCC, Broadcom,
Cavium, Freescale, Intel, PMC-Sierra, Raza, AMD,
IBM, PA Semi, SafeNet, and many more. These speedy chips
are used for handling the complex functions required by networking
applications, automotive, consumer devices, industrial control,
medical imaging, and more.
|
| A
Guide to Backplane Switch Chips, 5th Edition |
Published
Aug. 2006 |
This
report covers backplane switch chips for networking and data
center applications. The report provides coverage
of switch components from Fulcrum Microsystems, StarGen,
Fujitsu, and NextIO. As well as new products from Enigma,
PMC-Sierra, and Mercury Computer. Also covered are proprietary
switches, RapidIO switches, ASI switches, Ethernet switches
for the backplane, and updates on the traditional fabric
vendors and their products, including the latest information
on acquisitions and consolidations.
|
About
Our Reports
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as each vendor provides and reviews information about their products.
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