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Most Recent Guides & Forecasts

A Guide to Processors for Deep Learning
Covers processors for accelerating deep learning, neural networks, and vision processing for AI training and inference in data centers, autonomous vehicles, and client devices.
Communications Semiconductor Market Forecast 2018–2023
Provides five-year revenue forecasts for more than 20 categories of communications semiconductors, including Ethernet products, broadband interface chips, embedded processors, server processors and FPGAs.
Communications Semiconductor Market Share 2018
Provides market share data for more than 20 categories of communications semiconductors, including Ethernet products, broadband interface chips, embedded processors, server processors and FPGAs.
A Guide to Processors for Deep Learning
Covers processors and IP cores for accelerating deep learning, neural networks, and vision processing for AI training and inference in data centers, autonomous vehicles, and client devices.
A Guide to Multicore Processors
Covers 32- and 64-bit embedded processors with four or more CPU cores that are used for wires and wireless communications, storage, security, and other applications.
A Guide to Ethernet Switch and PHY Chips
Covers data-center switch chips for 10G, 25G, 40G, 50G, and 100G Ethernet. Also includes physical-layer (PHY) chips for 10GBase-T and 100G Ethernet.

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White Papers

Accelerating AI Performance in an Open Software Ecosystem
Nvidia's software stack, based on its proprietary CUDA, creates a high barrier to entry for challengers. SYCL, the only open alternative to CUDA that has multivendor support, enables customers to move to higher performance hardware while retaining software flexibility. A commercial version of SYCL, branded ComputeCpp, is offered by Codeplay.
Arm Ecosystem Reduces SoC Design Cost and Time to Market
This paper discusses three critical facets of the Arm ecosystem: design verification, physical design, and software development. Each one directly affects the time required to develop a complete SoC and software stack.
AI Requires Many Approaches
Artificial intelligence (AI) is being applied to a wide range of problems, so no single processor can support them all. This paper describes and compares the various approaches needed for data center, autonomous driving, and consumer/IoT applications. 
Universal RDMA: A Unique Approach for Heterogeneous Data-Center Acceleration
Now available in 10G, 25G, 50G, and 100G Ethernet server adapters, RDMA reduces network processing overhead and minimizes latency. Cavium's FastLinQ stands out by handling both RoCE and iWARP, which are alternative protocols for RDMA over Ethernet.
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January 20, 2020

Year in Review: Arm Flexes IP to Battle RISC-V
Arm was by far the most active processor-IP vendor in 2019, but the RISC-V community also surged. Licensable cores for AI acceleration joined a flood of new CPU, DSP, and GPU cores.
Intel Extends 3D Packaging With ODI
Intel’s new Omni-Directional Interconnect builds on EMIB and Foveros to improve performance, capabilities, and flexibility for products using 3D packaging.

January 13, 2020

Year in Review: 5G Smartphones Ready to Boom
After an initial launch in 2019, 5G smartphone shipments are set to soar in 2020. The new year will also see greater use of AI, the first 5nm processors, and more gaming phones.
Marvell Accelerates In-Car Networks
Marvell is sampling the second generation of its purpose-built automotive switch chips. It also bought Aquantia, adding PHYs to its multigigabit automotive-Ethernet portfolio.
GreenWaves GAP9 Goes Faster
GreenWaves’ new low-power RISC-V microcontroller uses FD-SOI and a second-generation deep-learning accelerator to increase power efficiency on AI workloads by 5x.

January 6, 2020

Groq Rocks Neural Networks
The startup has created a new AI architecture that implements a single massive programmable engine rated at an industry-leading 1,000 TOPS. It runs ResNet-50 with extremely low latency.
Year in Review: AI Is Livin’ on the Edge
Embedded-processor trends include adding AI acceleration, stronger chip-level security, multidie packaging, advanced driver-assistance systems (ADASs), and microcontrollers that either omit flash memory or replace it.

December 30, 2019

Snapdragon 765 Enables 5G Roaming
Qualcomm’s new mid-premium platform, the Snapdragon 765, is the industry’s first to integrate a 5G mmWave and sub-6GHz capability. The first phones using it should arrive in 1Q20.
Editorial: Custom Chips Are Back in Vogue
Hyperscale-data-center operators and wireless-infrastructure OEMs are creating new demand for ASICs. New ASIC vendors such as Intel and Marvell use large IP catalogs to allow customers to focus on their own IP.

December 23, 2019

Snapdragon 865 Dis-Integrates
Qualcomm’s newest flagship smartphone processor requires separate 5G and Wi-Fi chips but delivers leading-edge performance and works with millimeter-wave networks.
MediaTek Rides 5G to Flagship Phones
The Dimensity 1000 is MediaTek’s first 5G processor and allows it to target premium smartphones with the latest CPU and GPU cores plus strong AI performance.

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2020 Spring Processor Conference - Save the Date

Events

Linley Spring Processor Conference 2020
Coming April 7-8, 2020
Hyatt Regency, Santa Clara, CA
Linley Fall Processor Conference 2020
Coming October 28-29, 2020
Hyatt Regency, Santa Clara, CA
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Newsletter

Linley Newsletter
Analysis of new developments in microprocessors and other semiconductor products
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