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i.MX RT1170: Fastest Flashless MCU
NXP’s new i.MX RT1170 combines microcontroller features with high performance. Its 1.0GHz Cortex-M7 is the fastest CPU in its class, and its 400MHz Cortex-M4 coprocessor is also swift for its breed.
Innovium Moves Down Market
Teralynx 5 line ranges from 1.2Tbps to 6.4Tbps, extending the company’s portfolio to lower-cost and lower-power systems. It follows the 12.8Tbps Teralynx 7, which reached production in 1Q19.
Intel Slashes Pricing on X-Series
Intel recently updated its Core X-series for high-end desktops and its related Xeon W for workstations. The big news, however, is dramatically reduced prices, a response to increased competitive pressure from AMD.
Arm Joins Bfloat Parade
To accelerate neural-network training, Arm will support the Bfloat16 data format, which doubles throughput for the matrix-multiplication operations at the heart of most AI models.
Everspin Raises MRAM Density
The leader in discrete MRAM is shipping a 1Gb device, narrowing the density gap to DRAM. GlobalFoundries offers the Everspin technology for embedded MRAM.
Ceva and Synopsys Spin More TOPS
To support neural-network inference in autonomous vehicles and other high-performance edge devices, new multicore deep-learning accelerators can generate 100 TOPS or more.
Exynos 980 Integrates 5G Modem
The Exynos 980 5G is Samsung’s first smartphone processor to integrate a 5G modem. The first processor to use Arm’s Cortex-A77, it also features Samsung’s fastest deep-learning accelerator.
Huawei Delivers Powerful AI Training
The company’s new Ascend 910 takes its DaVinci architecture into the top performance tier in AI training. Huawei will deliver accelerator cards, servers, and clusters incorporating the chip.
Kirin 990 First to Integrate 5G
Huawei is the first company to fully announce a processor with an integrated 5G modem. The new flagship processor also leads in smartphone AI performance.
Prepare for Copackaged Optics
Electrical-I/O pin bandwidths are almost out of runway, and chips will soon hit the serdes wall. Copackaged optics provide a path forward by reducing reach, but they present a new set of challenges.
Broadcom Ships PCIe Gen4 Switches
The PCI-SIG has completed its first compliance tests for PCI Express 4.0. The integrator’s list includes Broadcom’s PEX88000 PCIe Gen4 switch chip, which is now in production.
Power9 AIO Boosts DRAM Bandwidth
IBM’s new Power9 AIO (Advanced I/O) server processor introduces the Open Memory Interface (OMI)—a superfast alternative to DDR4. Special DIMMs boost the peak bandwidth to 410GB/s, making Power9 ideal for memory-intensive applications.
Qualcomm Updates Wi-Fi 6 Portfolio
Qualcomm updated its Wi-Fi 6 products for both infrastructure and smartphones, also rebranding those respective lines as Networking Pro Series and FastConnect. Both achieved Wi-Fi Certified 6 status in the Wi-Fi Alliance’s new certification program.
Tsinghua Pedals Hybrid AI Processor
Tianjic’s novel hybrid architecture can concurrently run convolutional neural networks, multilayer perceptrons, recurrent neural networks, and other deep neural networks, as well as biologically inspired continuous-attractor and spiking neural networks.
HPE Reveals Gen-Z Fabric Chipset
At Hot Chips, HPE disclosed industry-first Gen-Z bridge and switch chips with copackaged optics. They target exascale systems rather than mainstream servers.
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